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3-D FDFD non-conformal domain decomposition method for modeling RDL traces on silicon interposer File

Xie, Biancun , Swaminathan, Madhavan , Han, Ki Jin , Xie, Jianyong

Conference Paper Issue Date2014-05-11 View35

3D Path finder methodology for the design of 3DICs and interposers File

Swaminathan, Madhavan , Martin, Bill , Han, Ki Jin

Conference Paper Issue Date2013 View23

A path finding based SI design methodology for 3D integration File

Han, Ki Jin , Martin, Bill , Swaminathan, Madhavan

Conference Paper Issue Date2014-05 View28

Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse File

Kim, Jinwoo , Murali, Gauthaman , Park, Heechun , Qin, Eric , Kwon, Hyoukjun , Chekuri, Venkata Chaitanya Krishna , Rahman, Nael Mizanur , Dasari, Nihar , Singh, Arvind , Lee, Minah , et al

Article Issue Date2020-11 View46

Clock Delivery Network Design and Analysis for Interposer-Based 2.5-D Heterogeneous Systems File

Murali, Gauthaman , Park , Heechun , Qin, Eric , Torun, Hakki Mert , Dolatsara, Majid Ahadi , Swaminathan, Madhavan , Krishna, Tushar , Lim, Sung Kyu

Article Issue Date2021-04 View33

Combined Integral Equation Based Circuit Modeling of Interconnections in Electronic Packaging File

Han, Ki Jin , Swaminathan, Madhavan

Conference Paper Issue Date2016-11-15 View26

Consideration of MOS Capacitance Effect in TSV Modeling Based on Cylindrical Modal Basis Functions File

Han, Ki Jin , Swaminathan, Madhavan

Conference Paper Issue Date2012-12-09 View59

Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems File

Han, Ki Jin , Xie, Biancun , Swaminathan, Madhavan , Xie, Jianyong

Conference Paper Issue Date2011-08-14 View29

Design Flow for Active Interposer-Based 2.5-D ICs and Study of RISC-V Architecture With Secure NoC File

Park, Heechun , Kim, Jinwoo , Chekuri, Venkata Chaitanya Krishna , Dolatsara, Majid Ahadi , Nabeel, Mohammed , Bojesomo, Alabi , Patnaik, Satwik , Sinanoglu, Ozgur , Swaminathan, Madhavan , Mukhopadhyay, Saibal , et al

Article Issue Date2020-12 View36

Design Space Exploration of Power Delivery in Heterogeneous Integration

Torun, Hakki Mert , Park, Heechun , Lim, Sung Kyu , Swaminathan, Madhavan

Conference Paper Issue Date2019-03-25 View39

Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions File

Han, Ki Jin , Swaminathan, Madhavan , Bandyopadhyay, Tapobrata

Article Issue Date2010-11 View47

Eye-pattern design for high-speed differential links using extended passive equalization File

Han, Ki Jin , Takeuchi, Hayato , Swaminathan, Madhavan

Article Issue Date2008-05 View45

FDFD Nonconformal Domain Decomposition Method for the Electromagnetic Modeling of Interconnections in Silicon Interposer File

Xie, Biancun , Swaminathan, Madhavan , Han, Ki Jin

Article Issue Date2015-06 View60

Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions File

Han, Ki Jin , Swaminathan, Madhavan

Article Issue Date2009-06 View50

Modeling of Power Distribution Networks for Path Finding File

Han, Ki Jin , Sandeep, Srikumar , Martin, Bill , Swaminathan, Madhavan

Conference Paper Issue Date2015-10-25 View32

Modeling of Through-Silicon Via (TSV) Interposer Considering Depletion Capacitance and Substrate Layer Thickness Effects File

Han, Ki Jin , Swaminathan, Madhavan , Jeong, Jongwoo

Article Issue Date2015-01 View57

Rigorous Electrical Modeling of Through Silicon Vias (TSVs) with MOS Capacitance Effects File

Bandyopadhyay, Tapobrata , Han, Ki Jin , Chung, Daehyun , Chatterjee, Ritwik , Swaminathan, Madhavan , Tummala, Rao

Article Issue Date2011-06 View54

Robust Method for Analysis of Power Distribution Networks File

Han, Ki Jin , Martin, Bill , Swaminathan, Madhavan

Conference Paper Issue Date2015-12-16 View30

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