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Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions File

Han, Ki Jin , Swaminathan, Madhavan , Bandyopadhyay, Tapobrata

Article Issue Date2010-11 View7
Eye-pattern design for high-speed differential links using extended passive equalization File

Han, Ki Jin , Takeuchi, Hayato , Swaminathan, Madhavan

Article Issue Date2008-05 View5
FDFD Nonconformal Domain Decomposition Method for the Electromagnetic Modeling of Interconnections in Silicon Interposer File

Xie, Biancun , Swaminathan, Madhavan , Han, Ki Jin

Article Issue Date2015-06 View6
Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions File

Han, Ki Jin , Swaminathan, Madhavan

Article Issue Date2009-06 View5
Modeling of Power Distribution Networks for Path Finding File

Han, Ki Jin , Sandeep, Srikumar , Martin, Bill , Swaminathan, Madhavan

Conference Paper Issue Date2015-10-25 View6
Modeling of Through-Silicon Via (TSV) Interposer Considering Depletion Capacitance and Substrate Layer Thickness Effects File

Han, Ki Jin , Swaminathan, Madhavan , Jeong, Jongwoo

Article Issue Date2015-01 View6
Rigorous Electrical Modeling of Through Silicon Vias (TSVs) with MOS Capacitance Effects File

Bandyopadhyay, Tapobrata , Han, Ki Jin , Chung, Daehyun , Chatterjee, Ritwik , Swaminathan, Madhavan , Tummala, Rao

Article Issue Date2011-06 View7
Robust Method for Analysis of Power Distribution Networks File

Han, Ki Jin , Martin, Bill , Swaminathan, Madhavan

Conference Paper Issue Date2015-12-16 View5
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