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3D 프린팅 제품 및 부품의 신뢰성 평가를 위한 가속 실험 설계

Ha, Sangho , Han, Hweeyoung , Yoon, Jeongah , Kim, Namhun , Kwon, Daeil

Conference Paper Issue Date2014-11-12 View12

A Digital Signal-based Method for Real-time Diagnosis of Wire Health

이진우 , 권대일

Conference Paper Issue Date2017-05-12 View7

A Digital Signal-based Prognostic Approach to Factory Automation

Lee, Jinwoo , Kwon, Daeil

Conference Paper Issue Date2017-07-12 View5

A DIGITAL TECHNIQUE FOR DIAGNOSING INTERCONNECT DEGRADATION BY USING DIGITAL SIGNAL CHARACTERISTICS File

Lee, Jinwoo , Kwon, Daeil

Article Issue Date2017-02 View5

A dimensional compensation algorithm for vertical bending deformation of 3D printed parts in selective laser sintering File

Ha, Sangho , Ransikarbum, Kasin , Han, Hweeyoung , Kwon, Daeil , Kim, Hyeonnam , Kim, Namhun

Article Issue Date2018-08 View10

A Framework for Prognostics and Health Management Applications toward Smart Manufacturing Systems File

Shin, Insun , Lee, Junmin , Lee, Jun Young , Jung, Kyusung , Kwon, Daeil , Youn, Byeng D. , Jang, Hyun Soo , Choi, Joo-Ho

Article Issue Date2018-08 View9

A model-based prognostic approach to predict interconnect failure using impedance analysis File

Kwon, Daeil , Yoon, Jeongah

Article Issue Date2016-10 View6

A Model-based Prognostic Approach to Predict Remaining Useful Life of Inter-connects using Impedance Analysis

Kwon, Daeil , Yoon, Jeongah

Conference Paper Issue Date2015-11-24 View4

A Prognostic Method of Assessing Solder Joint Reliability Based on Digital Signal Characterization File

Yoon, Jeongah , Shin, Insun , Park, Juyoung , Kwon, Daeil

Conference Paper Issue Date2015-05-26 View6

A SENSORLESS APPROACH OF INTERCONNECT FAILURE DETECTION FOR PROGNOSTICS OF ELECTRONICS

Lee, Jinwoo , Kwon, Daeil

Conference Paper Issue Date2016-08-26 View6

Lee, Changyong , Kwon, Daeil

Article Issue Date2018-04 View6

Accelerated Degradation Model for C-rate Loading of Lithium-ion Batteries File

Saxena, Saurabh , Kwon, Daeil , Pecht, Michael , Xing, Yinjiao

Article Issue Date2019-05 View11

Accelerated Life Test of Optoelectronic Devices and Lifetime Prediction based on Bayesian Approaches

신인선 , 권대일

Conference Paper Issue Date2017-05-12 View7

Accelerated Stress Testing Methodology to Risk Assess Silicon-Package Thermo-Mechanical Failure Modes Resulting from Moisture Exposure under Use Conditions File

Rangaraj, Sudarshan , Kwon, Daeil , Pei, Min , Hicks, Jeffrey , Leatherman, G , Lucero, Alan , Wilson, Terri , Streit, Sarah , He, Jun

Conference Paper Issue Date2013-04-14 View5

Adaptive SVM-based Real-time Quality Assessment for Primer-Sealer Dispensing Process of Sunroof Assembly Line File

Oh, YeongGwang , Ransikarbum, Kasin , Busogi, Moise , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2017-07-12 View13

Adaptive SVM-based Real-time Quality Assessment for Primer-Sealer Dispensing Process of Sunroof Assembly Line File

Oh, YeongGwang , Ransikarbum, Kasin , Busogi, Moise , Kwon, Daeil , Kim, Namhun

Article Issue Date2019-04 View4

Advances and Challenges in PHM Based Risk Assessment of Electronics Systems

Kwon, Daeil

Conference Paper Issue Date2014-08-25 View8

Advances and Challenges in Prognostics and Health Management: Need for Interdisciplinary Teaching and Learning

Kwon, Daeil

Conference Paper Issue Date2017-01-03 View5

An Analysis of Quality Monitoring and Control System using Real-Time, Integrated Cost Effectiveness and Support Vector Machine

Oh, YeongGwang , Ransikarbum, Kasin , Busogi, Moise , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2017-07-12 View13

An Approach to Monitor Interconnect Degradation for Prognostics of Electronics Based on Digital Signal Characterization

Yoon, Jeongah , Kwon, Daeil

Conference Paper Issue Date2016-07-26 View10

Comparative Analysis of Interconnect Degradation using RF Impedance and Event Detectors

Kwon, Daeil , None

Conference Paper Issue Date2010-04-06 View8

Deep Neural Network for Fault Diagnosis of Power Transformers using Dissolved Gas Analysis

Kim, Sunuwe , Jang, Beomchan , Youn, Byeng D. , Kwon, Daeil , Park, Byeong-Cheol

Conference Paper Issue Date2017-07-14 View8

Defect state and severity analysis using discretized state vectors File

Baek, Soojung , Baek, Woonsang , Kwon, Daeil , Kim, Duck Young

Article Issue Date2018-06 View13

Define Electrical Packaging Temperature Cycling Requirement with Field Measured User Behavior Data File

Kwon, Daeil , Pei, Min , Han, Ru , Lucero, Alan , Vasudevan, Vasu , Kwasnick, Robert , Polasam, Praveen S

Conference Paper Issue Date2013-05-28 View2

Degradation of Digital Signal Characteristics due to Intermediate Stages of Interconnect Failure File

Kwon, Daeil , Azarian, M.H. , Pecht, M.

Conference Paper Issue Date2010-05-09 View12

Detection of Failure Precursors in Multilayer Ceramic Capacitors Based on Symbolic Time Series Analysis File

Park, Juyoung , Kwon, Daeil

Article Issue Date2016-01 View8

Detection of MLCC failure precursors based on Symbolic Time Series Analysis

Park, Juyoung , Kwon, Daeil

Conference Paper Issue Date2015-10-15 View9

Detection of Solder Joint Degradation Using RF Impedance Analysis File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-05-27 View10

Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies Using RF Impedance Analysis File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Conference Paper Issue Date2009-05-26 View6

Development of a Non-Invasive On-Chip Interconnect Health Sensing Method Based on Bit Error Rates File File

Shin, Insun , Koo, Kyoungmin , Kwon, Daeil

Article Issue Date2018-10 View19

Development of Accelerated Life Test for Modules of Semiconductor Equipment

박주영 , 신인선 , 권대일

Conference Paper Issue Date2016-04-28 View7

Early Degradation Detection of the Insulation Resistance of MLCCs by the Pattern Analysis of Capacitance and Dissipation Signals

Baek, Soojeong , Kwon, Daeil , Kim, Duck Young

Conference Paper Issue Date2017-10-18 View11

Early Degradation Detection of the Insulation Resistance of Multi-Layer Ceramic Capacitors by the Pattern Analysis of Capacitance and Dissipation Signals File

Baek, Sujeong , Kwon, Daeil , Kim, Duck Young

Article Issue Date2018-09 View14

Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Article Issue Date2009-06 View13

Early detection of interconnect degradation using RF impedance and SPRT File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-10-06 View17

Early identification of emerging technologies: A machine learning approach using multiple patent indicators File

Lee, Changyong , Kwon, Ohjin , Kim, Myeongjung , Kwon, Daeil

Article Issue Date2018-02 View13

Effect of humidity changes on dimensional stability of 3D printed parts by selective laser sintering File

Kwon, Daeil , Park, Eunju , Ha, Sangho , Kim, Namhun

Article Issue Date2017-09 View8

Effect of Solder Joint Degradation on RF Impedance File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-05-12 View12

Effect of Uncertain Material Properties on Fan-Out Wafer Level Packaging using Finite Element Analysis

Kim, Geumtaek , Kwon, Daeil

Conference Paper Issue Date2018-10-26 View10

Failure Prediction of MLCCs using Symbolic Time Series Analysis

Park, Juyoung , Kwon, Daeil

Conference Paper Issue Date2015-11-11 View8

Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Humidity-Bias Testing Conditions Using Non-Linear Modeling File File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Article Issue Date2013-09 View15

FEA Modeling and Solder Fatigue Model for New Physical Damage Based UC to TC Requirement Approach File

Kwon, Daeil , Han, Ru , Pei, Min , Lucero, Alan , Ge, Yun , Harries, Richard , Zheng, Tieyu

Conference Paper Issue Date2013-05-28 View4

Hygroscopic Swelling Behavior of 3D Printed Parts due to Changes in Environmental Conditions File

Park, Ju-young , Ha, Sangho , Park, Eunju , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2016-08-21 View9

HYGROSCOPIC SWELLING BEHAVIOR OF 3D PRINTED PARTS DUE TO CHANGES IN ENVIRONMENTAL CONDITIONS File

Park, Juyoung , Ha, Sangho , Park, Eunjoo , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2016-08-23 View9

Hygroscopic swelling behavior of Nylon 12 parts produced via selective laser sintering process

Ha, Sangho , Park, Eunjoo , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2016-10-10 View8

Identification of Interconnect Failure Mechanisms Using RF Impedance Analysis File

Kwon, Daeil , None

Conference Paper Issue Date2009-51-02 View13

Improved Reliability Prediction Methodology for Electronic Packages Using RF Impedance Analysis

Kwon, Daeil

Conference Paper Issue Date2013 View3

Industry 4.0: A Special Section in IEEE Access File File

Su, Shun-Feng , Rudas, Imre J. , Zurada, Jacek M. , Er, Meng Joo , Chou, Jyh-Horng , Kwon, Daeil

Article Issue Date2017-07 View9

Interconnect Failure Detection using Digital Signal Characteristics of Electronics

이진우 , 권대일

Conference Paper Issue Date2016-04-07 View6

IoT-Based Prognostics and Systems Health Management for Industrial Applications File File

Kwon, Daeil , Hodkiewicz, Melinda , Fan, Jiajie , Shibutani, Tadahiro , Pecht, Michael G.

Article Issue Date2016-07 View10

Knowledge Based Risk Assessment for Electronic Products and Systems Based on Probabilistic Use Condition

Kwon, Daeil

Conference Paper Issue Date2014-04-03 View8

Life Test Planning for Improved Reliability Prediction under Limited Time-to-Failure Data

Kwon, Daeil

Conference Paper Issue Date2015-10-23 View9

Lifetime Prediction of Optocouplers in Digital Input and Output Modules based on Bayesian tracking approaches

Shin, Insun , Kwon, Daeil

Conference Paper Issue Date2017-07-12 View8

Lifetime Prediction of Optocouplers in Digital Input and Output Modules based on Bayesian Tracking Approaches File

Shin, Insun , Kwon, Daeil

Article Issue Date2018-08 View5

Managerial and Industrial Information Prognosis: from Business Decision Making to Asset Management

Kwon, Daeil , Shin, Jiseon

Conference Paper Issue Date2018-08-06 View4

Non-Destructive Wire Fault Diagnosis Using Resistance Spectroscopy Analysis

Park, Eunjoo , Kwon, Daeil

Conference Paper Issue Date2018-08-21 View11

Nondestructive Sensing of Interconnect Failure Mechanisms Using Time-Domain Reflectometry File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Article Issue Date2011-05 View13

Optimal Interval Censoring Design for Reliability Prediction of Electronic Packages File File

Kwon, Daeil , Shin, Insun

Article Issue Date2015-06 View8

Optimized Reliability Test Design to Reduce Uncertainties in Reliability Assessment File

Kwon, Daeil , None

Conference Paper Issue Date2012-05-29 View6

Optimized Stress Allocation Strategies for Qualification of Electronic Products

Kwon, Daeil

Conference Paper Issue Date2013-10-06 View6

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