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FEA Modeling and Solder Fatigue Model for New Physical Damage Based UC to TC Requirement Approach
- Author(s)
- Kwon, Daeil, Han, Ru, Pei, Min, Lucero, Alan, Ge, Yun, Harries, Richard, Zheng, Tieyu
- Issued Date
- 2013-05-28
- Citation
- IEEE Electronic Components and Technology Conference
- Publisher
- IEEE
- ISBN
- 978-147990233-0
- ISSN
- 0569-5503
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