Define Electrical Packaging Temperature Cycling Requirement with Field Measured User Behavior Data

Abstract

In this paper, a user behavior based solder joint reliability modeling approach has been proposed to estimate the design and test requirements for the second level interconnect (SLI) reliability prediction. This approach uses a numerical tool to integrate solder joint creep damage during the actual use condition that was collected from a large user sample size. The resultant damage per time period was then input to the solder joint fatigue model to estimate equivalent damage to testing duration. The is a physics based approach and is expected to provide more accurate product life prediction and reliability performance demand for BGA package designs. © 2013 IEEE.