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Effect of Uncertain Material Properties on Fan-Out Wafer Level Packaging using Finite Element Analysis
- Author(s)
- Kim, Geumtaek, Kwon, Daeil
- Issued Date
- 2018-10-26
- Citation
- 17th International Symposium on Microelectronics and Packaging (ISMP 2018)
- Publisher
- 한국마이크로전자및패키징학회
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