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A Model-based Prognostic Approach to Predict Remaining Useful Life of Inter-connects using Impedance Analysis

Author(s)
Kwon, Daeil, Yoon, Jeongah
Issued Date
2015-11-24
URI
https://scholarworks.unist.ac.kr/handle/201301/41613
Citation
International Conference on materials and reliability
Publisher
International Conference on materials and reliability

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