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A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects File

Eom, Tae-Kwang , Sari, Windu , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Woo Kyoung

Article Issue Date2012-10 View87

Advanced Atomic Layer Modulation Based Highly Homogeneous PtRu Precious Metals Alloy Thin Films File File

Son, Yeseul , Kim, Sang Bok , Mohapatra, Debananda , Cheon, Taehoon , Kim, Soo-Hyun

Article Issue Date2025-08 View106

ALD-Grown Al2O3 as a Diffusion Barrier for Stainless Steel Substrates for Flexible Cu(InGa)Se-2 Solar Cells File

Park, Hyeonwook , Kim, Sung Cheol , Bae, Hae Chul , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Woo Kyoung

Article Issue Date2011-10 View75

Atomic Layer Deposited Highly Conductive Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects File

Park, Chaehyun , Kweon, Minjeong , Mohapatra, Debananda , Cheon, Taehoon , Bae, Jong-Seong , Jeong, Daeyoon , Park, Young-Bae , Kim, Soo-Hyun

Conference Paper Issue Date2025-06-03 View28

Atomic layer deposited Mo2N thin films using Mo(CO)(6) and NH3 plasma as a Cu diffusion barrier File File

Joo, Yong-Hwan , Nandi, Dip K. , Ramesh, Rahul , Jang, Yujin , Bae, Jong-Seong , Cheon, Taehoon , Kim, Soo-Hyun

Article Issue Date2021-03 View97

Atomic Layer Deposited RuO2 Diffusion Barrier for Next Generation Ru-Interconnects File

Kim, Youn-Hye , Kim, Minsu , Kotsugi, Yohei , Cheon, Taehoon , Mohapatra, Debananda , Jang, Yujin , Bae, Jong-Seong , Hong, Tae Eun , Ramesh, Rahul , An, Ki-Seok , et al

Article Issue Date2022-10 View127

Atomic Layer Deposition of Co Using N-2/H-2 Plasma as a Reactant File

Yoon, Jaehong , Lee, Han-Bo-Ram , Kim, Doyoung , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Hyungjun

Article Issue Date2011-10 View141

Atomic Layer Deposition of Ru for Replacing Cu-Interconnects File

Kotsugi, Yohei , Han, Seung-Min , Kim, Youn-Hye , Cheon, Taehoon , Nandi, Dip K. , Ramesh, Rahul , Yu, Neung-Kyung , Son, Kirak , Tsugawa, Tomohiro , Ohtake, Shigeyuki , et al

Article Issue Date2021-07 View174

Atomic layer deposition of Ru thin film using N-2/H-2 plasma as a reactant File

Hong, Tae Eun , Mun, Ki-Yeung , Choi, Sang-Kyung , Park, Ji-Yoon , Kim, Soo-Hyun , Cheon, Taehoon , Kim, Woo Kyoung , Lim, Byoung-Yong , Kim, Sunjung

Article Issue Date2012-07 View134

Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant File

Jung, Jae-Hun , Lee, Seung-Joon , Lee, Hyun-Jung , Lee, Min Young , Cheon, Taehoon , Bae, So Ik , Saito, Masayuki , Suzuki, Kazuharu , Nabeya, Shunichi , Lee, Jeongyeop , et al

Article Issue Date2015-11 View121

Atomic Layer Deposition of RuAlO Thin Films as a Diffusion Barrier for Seedless Cu Interconnects File

Cheon, Taehoon , Choi, Sang-Hyeok , Kim, Soo-Hyun , Kang, Dae-Hwan

Article Issue Date2011-03 View92

Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization File

Yeo, Seungmin , Choi, Sang-Hyeok , Park, Ji-Yoon , Kim, Soo-Hyun , Cheon, Taehoon , Lim, Byoung-Yong , Kim, Sunjung

Article Issue Date2013-11 View74

Atomic layer modulation (ALM) process for preparing atomic-scale homogeneous alloy thin films

Son, Yeseul , Cheon, Taehoon , Kim, Sang-Bok , Mohapatra, Debananda , Kim, Soo-Hyun

Conference Paper Issue Date2024-10-19 View86

Atomic Layer Modulation of Multicomponent Thin Films through Combination of Experimental and Theoretical Approaches File

Nguyen, Chi Thang , Gu, Bonwook , Cheon, Taehoon , Park, Jeongwoo , Khan, Mohammad Rizwan , Kim, Soo-Hyun , Shong, Bonggeun , Lee, Han-Bo-Ram

Article Issue Date2021-06 View142

Atomic Layer Modulation of Ruthenium Aluminum Oxide through Reactivity Control of Precursors for Seedless Copper Interconnects File

Nguyen, Chi Thang , Kim, Miso , Kim, Youn-Hye , Cheon, Taehoon , Trinh, Ngoc Le , Kim, Sehee , Kim, Soo-Hyun , Shong, Bonggeun , Lee, Han-Bo-Ram

Article Issue Date2025-12 View28

Atomic-Layer-Deposited MoNx Thin Films on Three-Dimensional Ni Foam as Efficient Catalysts for the Electrochemical Hydrogen Evolution Reaction File

Ramesh, Rahul , Nandi, Dip K. , Kim, Tae Hyun , Cheon, Taehoon , Oh, Jihun , Kim, Soo-Hyun

Article Issue Date2019-05 View128

Atomic-scale homogeneous PtRu alloy thin films prepared by atomic layer modulation (ALM)

Son, Yeseul , Kim, Sang Bok , Cheon, Taehoon , Kim, Soo-Hyun

Conference Paper Issue Date2024-08-07 View64

Cobalt titanium nitride amorphous metal alloys by atomic layer deposition File

Nam, Taewook , Lee, Chang Wan , Cheon, Taehoon , Lee, Woo Jae , Kim, Soo-Hyun , Kwon, Se-Hun , Lee, Han-Bo-Ram , Kim, Hyungjun

Article Issue Date2018-03 View153

Comparative Growth and Functional Integration of CeO2 Films via Plasma-Enhanced and Thermal ALD Using a Tailored Cerium Precursor for Artificial Synaptic Devices File File

Seo, Yewon , Mohapatra, Debananda , Moon, Sola , Bae, Jong-Seong , Cheon, Taehoon , Yoon, Tae-Sik , Kim, Soo-Hyun

Article Issue Date2026-03 View0

Comparative study on atomic layer deposition of HfO(2)via substitution of ligand structure with cyclopentadiene File

Park, Sungmin , Park, Bo-Eun , Yoon, Hwi , Lee, Sanghun , Nam, Taewook , Cheon, Taehoon , Kim, Soo-Hyun , Cheon, Hwansung , Im, Sangkyun , Seong, Taegeun , et al

Article Issue Date2020-01 View167

Controlled formation of MoSe2 by MoNx thin film as a diffusion barrier against Se during selenization annealing for CIGS solar cell File File

Jeon, Chan-Wook , Cheon, Taehoon , Kim, Hangil , Kwon, Min-Su , Kim, Soo-Hyun

Article Issue Date2015-09 View145

Detailed Visualization of Phase Evolution during Rapid Formation of Cu(InGa)Se-2 Photovoltaic Absorber from Mo/CuGa/In/Se Precursors File File

Koo, Jaseok , Kim, Sammi , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Woo Kyoung

Article Issue Date2018-03 View53

Development of RuS2 for near-infrared photodetector by atomic layer deposition and post-sulfurization File

Nakazawa, Tatsuya , Kim, Donghyun , Kim, Jaehyeok , Kotsugi, Yohei , Cheon, Taehoon , Chung, Seung-Min , Kim, Soo-Hyun , Kim, Hyungjun

Article Issue Date2022-09 View105

Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology File

Hong, Tae Eun , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Jeong-Kyu , Park, Young-Bae , Kwon, Oh Joong , Kim, Myung Jun , Kim, Jae Jeong

Article Issue Date2013-12 View92

Enhanced functional properties of ABC-type atomic layer deposited Ru thin films for advanced Cu alternative nanoscale interconnects File File

Kim, Jeongha , Mohapatra, Debananda , Son, Yeseul , Jang, Jae Min , Kim, Sang Bok , Hong, Tae Eun , Cheon, Taehoon , Shong, Bonggeun , Kim, Soo-Hyun

Article Issue Date2026-03 View3

Growth of highly conformal ruthenium-oxide thin films with enhanced nucleation by atomic layer deposition File

Park, Ji-Yoon , Yeo, Seungmin , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Min-Kyu , Kim, Hyungjun , Hong, Tae Eun , Lee, Do-Joong

Article Issue Date2014-10 View113

Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition File

Park, Chaehyun , Kweon, Minjeong , Mohapatra, Debananda , Cheon, Taehoon , Bae, Jong-Seong , Jeong, Daeyoon , Jang, Hyunwoo , Shim, Seungwon , Park, Young-Bae , Kang, Youngho , et al

Article Issue Date2025-07 View84

Highly Conformal Amorphous W-Si-N Thin Films by Plasma-Enhanced Atomic Layer Deposition as a Diffusion Barrier for Cu Metallization File

Hong, Tae Eun , Jung, Jae-Hun , Yeo, Seungmin , Cheon, Taehoon , Bae, So Ik , Kim, Soo-Hyun , Yeo, So Jeong , Kim, Hyo-Suk , Chung, Taek-Mo , Park, Bo Keun , et al

Article Issue Date2015-01 View110

Improved performance of atomic layer deposited Ru thin film prepared by 6-step ALD process as a Cu alternative interconnect

Kim, Jeongha , Kim, Sang Bok , Cheon, Taehoon , Son, Yeseul , Kim, Soo-Hyun

Conference Paper Issue Date2024-06-24 View98

Improved properties of atomic layer deposited Ru films by providing additional reactant for Cu alternative interconnects

Kim, Jeongha , Son, Yeseul , Cheon, Taehoon , Kim, Sang Bok , Kim, Soo-Hyun

Conference Paper Issue Date2024-08-06 View71

Improved Properties of Atomic Layer Deposited Ru Films by Providing Additional Reactant for Cu Alternative Nanoscale Interconnects File

Kim, Jeongha , Mohapatra, Debananda , Son, Yeseul , Jang, Jae Min , Kim, Sang Bok , Cheon, Taehoon , Shong, Boggeun , Kim, Soo-Hyun

Conference Paper Issue Date2025-06-04 View17

Influence of post-annealing on structural, optical and electrical properties of tin nitride thin films prepared by atomic layer deposition File File

Ansari, Mohd Zahid , Janicek, Petr , Nandi, Dip K. , Palka, Karel , Slang, Stanislav , Kim, Deok Hyun , Cheon, Taehoon , Kim, Soo-Hyun

Article Issue Date2021-02 View108

Layer Engineered MXene Empowered Wearable Pressure Sensors for Non-Invasive Vital Human-Machine Interfacing Healthcare Monitoring File

Mohapatra, Debananda , Byun, Jeong Eun , Ansari, Mohd Zahid , Kim, Haekyoung , Cheon, Taehoon , Jang, Jongmoon , Cho, Young-Rae , Lee, Jung Woo , Kim, Soo-Hyun

Article Issue Date2023-12 View100

Low temperature atomic layer deposited molybdenum nitride-Ni-foam composite: An electrode for efficient charge storage File

Nandi, Dip K. , Sahoo, Sumanta , Kim, Tae Hyun , Cheon, Taehoon , Sinha, Soumyadeep , Rahul, Ramesh , Jang, Yujin , Bae, Jong-Seong , Heo, Jaeyeong , Shim, Jae-Jin , et al

Article Issue Date2018-08 View105

Low-Temperature Atomic Layer Deposition of Highly Conformal Tin Nitride Thin Films for Energy Storage Devices File

Ansari, Mohd Zahid , Nandi, Dip K. , Janicek, Petr , Ansari, Sajid Ali , Ramesh, Rahul , Cheon, Taehoon , Shong, Bonggeun , Kim, Soo-Hyun

Article Issue Date2019-11 View123

New class of Zr precursor containing boratabenzene ligand enabling highly conformal wafer-scale zirconium dioxide thin films through atomic layer deposition File

Ansari, Mohd Zahid , Janicek, Petr , Namgung, Sook , Kim, Hyangil , Nandi, Dip K. , Cheon, Taehoon , Siddiqui, Masoom Raza , Imran, Muhammad , Jang, Yujin , Bae, Jong-Seong , et al

Article Issue Date2024-03 View125

Plasma-Enhanced Atomic Layer Deposition of Yttrium Carbide Thin Films as a Promising Transition Metal Carbide for Dual Diffusion Barrier in Cu and Ru Metallization File

Kweon, Minjeong , Park, Chaehyun , Mohapatra, Debananda , Kim, Sang Bok , Bae, Jong-Seong , Cheon, Taehoon , Kim, Soo-Hyun

Conference Paper Issue Date2025-06-04 View13

Preparation of wafer-scale highly conformalamorphous hafnium dioxide thin films by atomic layer deposition using a thermally stable boratabenzene ligand-containing hafnium precursor File

Ansari, Mohd Zahid , Janicek, Petr , Park, Ye Jin , NamGung, Sook , Cho, Bo Yeon , Nandi, Dip K. , Jang, Yujin , Bae, Jong-Seong , Hong, Tae Eun , Cheon, Taehoon , et al

Article Issue Date2023-05 View147

Process Controlled Ruthenium on 2D Engineered V-MXene via Atomic Layer Deposition for Human Healthcare Monitoring File File

Mohapatra, Debananda , Shin, Yujin , Ansari, Mohd Zahid , Kim, Youn-Hye , Park, Ye Jin , Cheon, Taehoon , Kim, Haekyoung , Lee, Jung Woo , Kim, Soo-Hyun

Article Issue Date2023-04 View124

Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization File

Choi, Sang-Kyung , Kim, Hangil , Kim, Junbeam , Cheon, Taehoon , Seo, Jong Hyun , Kim, Soo-Hyun

Article Issue Date2015-09 View79

Rate performance enhancement of lithium-ion battery using precise thickness-controllable-carbon-coated titanium dioxide nanowire array electrode via atomic layer deposition File File

Choi, Taejin , Kim, Seong Dae , Yeo, Seungmin , Cheon, Taehoon , Kim, Soo-Hyun , Ahn, Jong-Hyun , Kim, Hyungjun

Article Issue Date2020-02 View92

Self‐Formation of a Ru/ZnO Multifunctional Bilayer for the Next‐Generation Interconnect Technology via Area‐Selective Atomic Layer Deposition File File

Mori, Yuki , Cheon, Taehoon , Kotsugi, Yohei , Kim, Youn‐Hye , Park, Yejin , Ansari, Mohd Zahid , Mohapatra, Debananda , Jang, Yujin , Bae, Jong‐Seong , Kwon, Woobin , et al

Article Issue Date2023-08 View136

Significant Enhancement of the Dielectric Constant through the Doping of CeO2 into HfO2 by Atomic Layer Deposition File

Kim, Woo-Hee , Kim, Min-Kyu , Oh, Il-Kwon , Maeng, Wan Joo , Cheon, Taehoon , Kim, Soo-Hyun , Noori, Atif , Thompson, David , Chu, Schubert , Kim, Hyungjun

Article Issue Date2014-04 View97

Small and Simple Molecular Structure Based Thermally Stable Ruthenium Precursor in Advancing Ruthenium ALD Process for Scaled Interconnect Metallization File File

Nakatsubo, Hideaki , Mohapatra, Debananda , Lee, Eun-soo , Kim, Jeongha , Cho, Iaan , Iseki, Masato , Shigetomi, Toshiyuki , Harada, Ryosuke , Na, Sang-woong , Cheon, Taehoon , et al

Article Issue Date2026-02 View23

Synthesis of Si Nanowires by Using Atmospheric Pressure Chemical Vapor Deposition with SiCl4 File

Choi, Taejin , Kim, Hyungjun , Kim, Doyoung , Cheon, Taehoon , Kim, Soo-Hyun

Article Issue Date2011-08 View76

The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect File

Mun, Ki-Yeung , Hong, Tae Eun , Cheon, Taehoon , Jang, Yujin , Lim, Byoung-Yong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2014-07 View93

Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating File File

Choi, Sang-Hyeok , Cheon, Taehoon , Kim, Soo-Hyun , Kang, Dae-Hwan , Park, Gye-Soon , Kim, Sunjung

Article Issue Date2011-03 View129

Thickness-dependent electrochemical response of plasma enhanced atomic layer deposited WS2 anodes in Na-ion battery File File

Nandi, Dip K. , Yeo, Seungmin , Ansari, Mohd Zahid , Sinha, Soumyadeep , Cheon, Taehoon , Kwon, Jiseok , Kim, Hyungjun , Heo, Jaeyeong , Song, Taeseup , Kim, Soo-Hyun

Article Issue Date2019-11 View122

Ultralow Loading (Single-Atom and Clusters) of the Pt Catalyst by Atomic Layer Deposition Using Dimethyl ((3,4-eta) N,N-dimethyl-3-butene-1-amine-N) Platinum (DDAP) on the High-Surface-Area Substrate for Hydrogen Evolution Reaction File

Ramesh, Rahul , Han, Seungmin , Nandi, Dip K. , Sawant, Sandesh Y. , Kim, Deok Hyun , Cheon, Taehoon , Cho, Moo Hwan , Harada, Ryosuke , Shigetomi, Toshiyuki , Suzuki, Kazuharu , et al

Article Issue Date2021-02 View91

Yttrium carbide thin film as an emerging transition metal carbide Prepared by plasma-enhanced atomic layer deposition for Dual diffusion barrier applications into Cu and Ru metallization File

Kweon, Minjeong , Park, Chaehyun , Mohapatra, Debananda , Kim, Sang Bok , Bae, Jong-Seong , Cheon, Taehoon , Kim, Soo-Hyun

Article Issue Date2025-08 View138

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