File Download
There are no files associated with this item.
SFX Link
- Find it @ UNIST can give you direct access to the published full text of this article. (UNISTARs only)
- Kim, Soo-Hyun
Views & Downloads
Detailed Information
Cited time in 
Cited time in 
Cited time in
Metadata Downloads
Plasma-Enhanced Atomic Layer Deposition of Yttrium Carbide Thin Films as a Promising Transition Metal Carbide for Dual Diffusion Barrier in Cu and Ru Metallization
- Author(s)
- Kweon, Minjeong, Park, Chaehyun, Mohapatra, Debananda, Kim, Sang Bok, Bae, Jong-Seong, Cheon, Taehoon, Kim, Soo-Hyun
- Issued Date
- 2025-06-04
- Citation
- 2025 IEEE International Interconnect Technology Conference, IITC 2025
- Abstract
- Transition metal carbides (TMCs) possess superior properties compared to transition metal nitrides (TMNs). However, despite their advantages, atomic layer deposition (ALD) and plasma-enhanced ALD (PEALD) techniques for these materials, particularly yttrium carbide (YC
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.