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- Kim, Soo-Hyun
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Improved Properties of Atomic Layer Deposited Ru Films by Providing Additional Reactant for Cu Alternative Nanoscale Interconnects
- Author(s)
- Kim, Jeongha, Mohapatra, Debananda, Son, Yeseul, Jang, Jae Min, Kim, Sang Bok, Cheon, Taehoon, Shong, Boggeun, Kim, Soo-Hyun
- Issued Date
- 2025-06-04
- Citation
- 2025 IEEE International Interconnect Technology Conference, IITC 2025
- Abstract
- This study designed the ABC-type Ru ALD process using O
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
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