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Kim, Soo-Hyun
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Atomic layer deposition of Ru thin film using N-2/H-2 plasma as a reactant

Author(s)
Hong, Tae EunMun, Ki-YeungChoi, Sang-KyungPark, Ji-YoonKim, Soo-HyunCheon, TaehoonKim, Woo KyoungLim, Byoung-YongKim, Sunjung
Issued Date
2012-07
DOI
10.1016/j.tsf.2012.05.069
URI
https://scholarworks.unist.ac.kr/handle/201301/64147
Fulltext
https://www.sciencedirect.com/science/article/pii/S0040609012006700?via%3Dihub
Citation
THIN SOLID FILMS, v.520, no.19, pp.6100 - 6105
Abstract
Ruthenium (Ru) thin films were grown by atomic layer deposition using IMBCHRu [(eta 6-1-Isopropyl-4-MethylBenzene)(eta 4-CycloHexa-1,3-diene)Ruthenium(0)] as a precursor and a nitrogen-hydrogen mixture (N-2/H-2) plasma as a reactant, at the substrate temperature of 270 degrees C. In the wide range of the ratios of N-2 and total gas flow rates (fN(2)/N-2+H-2) from 0.12 to 0.70, pure Ru films with negligible nitrogen incorporation of 0.5 at.% were obtained, with resistivities ranging from similar to 20 to similar to 30 mu Omega cm. A growth rate of 0.057 nm/cycle and negligible incubation cycle for the growth on SiO2 was observed, indicating the fast nucleation of Ru. The Ru films formed polycrystalline and columnar grain structures with a hexagonal-close-packed phase. Its resistivity was dependent on the crystallinity, which could be controlled by varying the deposition parameters such as plasma power and pulsing time. Cu was electroplated on a 10-nm-thick Ru film. Interestingly, it was found that the nitrogen could be incorporated into Ru at a higher reactant gas ratio of 0.86. The N-incorporated Ru film (similar to 20 at.% of N) formed a nanocrystalline and non-columnar grain structure with the resistivity of similar to 340 mu Omega cm. (C) 2012 Elsevier B. V. All rights reserved.
Publisher
ELSEVIER SCIENCE SA
ISSN
0040-6090
Keyword (Author)
RutheniumAtomic layer depositionNitrogen/hydrogen plasmaCopper metallizationSeed layerN-incorporationMicrostructure
Keyword
RUTHENIUMDIFFUSIONCOPPERDENSITYSIZE

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