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Guide wavelength estimation of sandwich-type double-layer slotline File

Han, Ki Jin , Kim, JP

Article Issue Date2004-11 View8

High-Frequency Modeling of AC Motors for EMC-Aware Design of Electrical Drives

Han, Ki Jin , Ryu, Younggon , Jo, Hyeokjun

Conference Paper Issue Date2015-11-23 View6

High-frequency stator-to-frame admittance modeling for AC machine by using Debye model File

Ryu, Younggon , Han, Ki Jin

Conference Paper Issue Date2016-05-17 View7

High-frequency testing of vertical interconnection array using indirect contact probing method with an improved calibration File

Jeong, Jongwoo , Kim, Jingook , Kang, No-Weon , Han, Ki Jin

Article Issue Date2016-11 View7

Highly-Sensitive Plasmonic Nano-Ring Transistor for Monolithic Terahertz Active Antenna File

Ryu, Min Woo , Patel, Ramesh , Jang, ESan , Ahn, Sang Hyo , Jeon, Hyeong Ju , Choe, Mun Seok , Choi, EunMi , Han, Ki Jin , Kim, Kyung Rok

Conference Paper Issue Date2017-07-26 View5

Identification of Parameter Domain for the Design of High-Speed I/O Interface File

Kim, Seungwon , Kim, Youngmin , Han, Ki Jin

Conference Paper Issue Date2015-12-15 View9

Impact of multiple scattering on passivity of equivalent-circuit via models File

Han, Ki Jin , Duan, Xiaomin , Rimolo-Donadio, Renato , Muller, Sebastian , Schuster, Christian , Gu, Xiaoxiong , Kwark, Young H , Brüns, Heinz-Dietrich

Conference Paper Issue Date2011-12-12 View7

Improved Transmission Line Model of the Stator Winding Structure of an AC Motor Considering High-frequency Conductor and Dielectric Effects File

Ryu, Younggon , Han, Ki Jin

Conference Paper Issue Date2017-05-24 View5

Indirect Contact Probing Method for Characterizing Vertical Interconnections in Electronic Packaging File

Jeong, Jongwoo , Kim, Jingook , Kang, No-Weon , Han, Ki Jin

Article Issue Date2015-01 View9

Indirect Contact Probing Method for Characterizing Via Arrays in Electronic Packaging File

Han, Ki Jin , Jeong, JongWoo , Kim, Jingook , Kang, No-Weon

Conference Paper Issue Date2014-12-15 View4

Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions File

Han, Ki Jin , Swaminathan, Madhavan

Article Issue Date2009-06 View7

Modeling of Power Distribution Networks for Path Finding File

Han, Ki Jin , Sandeep, Srikumar , Martin, Bill , Swaminathan, Madhavan

Conference Paper Issue Date2015-10-25 View11

Modeling of Through-Silicon Via (TSV) Interposer Considering Depletion Capacitance and Substrate Layer Thickness Effects File

Han, Ki Jin , Swaminathan, Madhavan , Jeong, Jongwoo

Article Issue Date2015-01 View7

Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth File

Han, Ki Jin , Gu, Xiaoxiong , Kwark, Young H. , Shan, Lei , Ritter, Mark B.

Article Issue Date2014-02 View6

Multi-Port Characterization of Vias Using Indirect Contact Probing Method File

Jeong, Jongwoo , Kim, Jingook , Kang, No-Weon , Han, Ki Jin

Conference Paper Issue Date2015-05-26 View11

Novel Adaptive Power Gating Strategy of TSV-based Multi-layer 3D IC File

Kim, Seungwon , Kang, Seokhyeong , Han, Ki Jin , Kim, Youngmin

Conference Paper Issue Date2015-03-04 View11

Novel adaptive power-gating strategy and tapered TSV structure in multilayer 3D IC File

Kim, Seung Won , Kang, Seokhyeong , Han, Ki Jin , Kim, Youngmin

Article Issue Date2016-07 View15

Optimal core shape design for cogging torque reduction of brushless DC motor using genetic algorithm File

Han, Ki Jin , Cho, HS , Cho, DH , Jung, HK

Article Issue Date2000-07 View8

Parametric study on the effect of asymmetry in multi-channel differential signaling File

Han, Ki Jin , Gu, Xiaoxiong , Kwark, Young H , Yu, Zhenwei , Liu, Dazhao , Archambeault, Bruce , Connor, Samuel R. , Fan, Jun

Conference Paper Issue Date2011-08-14 View9

PCB 및 팩키징 구조에서의 전파 특성

Han, Ki Jin

Article Issue Date2013-05 View7

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