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Han, Ki Jin
Electromagnetic System Design Lab
Research Interests
  • Electromagnetics, electromechanics, electromagnetic compatibility (EMC)

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Indirect Contact Probing Method for Characterizing Vertical Interconnections in Electronic Packaging

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Title
Indirect Contact Probing Method for Characterizing Vertical Interconnections in Electronic Packaging
Author
Jeong, JongwooKim, JingookKang, No-WeonHan, Ki Jin
Issue Date
2015-01
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.25, no.1, pp.70 - 72
Abstract
This letter proposes a new indirect contact probing method to characterize vertical interconnections without contact damage. At the first step of the proposed technique, multiple one-port calibration measurements should be performed to characterize the contactor layer between the probe pads and the device-under-tests (DUTs). The characteristics of the actual vias as the DUTs are then extracted from indirect-contact measurements by de-embedding the contactor layer. In simulations and experiments at frequencies range from 2.5 to 18 GHz, we have verified via defects can be successfully identified from the indirect-contact measurements.
URI
https://scholarworks.unist.ac.kr/handle/201301/9813
URL
https://ieeexplore.ieee.org/document/6960922
DOI
10.1109/LMWC.2014.2369951
ISSN
1531-1309
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EE_Journal Papers
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