| 2004 | Adhesion enhancement of norbornene polymers with lithocholate substituents for 193-nm resists | Kim, JB; Jang, Ji-Hyun; Ko, JS; Choi, JH; Lee, BW | ARTICLE | 605 |
| 2003-04 | Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis | Lee, BW; Jeong, JH; Jang, W; Kim, Ju-Young; Kim, DW; Kwon, D; Nah, JW; Paik, KW | ARTICLE | 618 |
| 2004-11 | Effect of substrate temperature on structure and intrinsic stress in vapor-deposited amorphous silicon carbide film | Kim, Ju-Young; Lee, BW; Nam, HS; Kwon, D | ARTICLE | 512 |
| 2005-03 | Influence of tip bluntness on the size-dependent nanoindentation hardness | Kim, Ju-Young; Lee, BW; Read, DT; Kwon, D | ARTICLE | 556 |
| 2004 | Molecular dynamics analysis of structure and intrinsic stress in amorphous silicon carbide film with deposition process parameters | Kim, Ju-Young; Lee, BW; Nam, HS; Kwon, D | ARTICLE | 527 |
| 2003-12 | Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry | Lee, BW; Kim, Ju-Young; Kwon, D | ARTICLE | 531 |
| 2004-07 | Synthesis and lithographic evaluation of poly[(methacrylic acid tert-butyl cholate ester)-co-(γ-butyrolactone-2-yl methacrylate)] | Kim, JB; Ko, JS; Choi, JH; Jang, Ji-Hyun; Oh, TH; Kim, HW; Lee, BW | ARTICLE | 609 |
