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Kim, Ju-Young
Robust Multifunctional Materials Lab
Research Interests
  • Flexible / stretchable devices, nano-mechanics, nanoporous metal, materials reliability

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Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry

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Title
Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry
Author
Lee, BWKim, Ju-YoungKwon, D
Keywords
Bulk solder;  Electronic speckle pattern interferometry (ESPI);  Finite-element modeling (FEM);  Flip-chip;  Reliability;  Stress-strain curve
Issue Date
2003-12
Publisher
SPRINGER
Citation
JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1322 - 1329
Abstract
Electronic speckle pattern interferometry (ESPI) was applied to noncontact, real-time evaluation of thermal deformation in a flip-chip solder joint. To measure the deformation of such tiny components as the solder balls in the flip-chip, the spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied. Experimental-computational procedures were developed to obtain stress-strain curves for solder balls in the flip-chip based on finite-element modeling (FEM) of in-plane ESPI thermal displacement data. The stress-strain curve obtained for the flip-chip solder was compared with those for bulk solder. The microstructure was also studied to clarify the stress-strain curve results.
URI
https://scholarworks.unist.ac.kr/handle/201301/7686
DOI
10.1007/s11664-003-0030-5
ISSN
0361-5235
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