| 2003-04 | Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis | Lee, BW; Jeong, JH; Jang, W; Kim, Ju-Young; Kim, DW; Kwon, D; Nah, JW; Paik, KW | ARTICLE | 618 |
| 2004-11 | Effect of substrate temperature on structure and intrinsic stress in vapor-deposited amorphous silicon carbide film | Kim, Ju-Young; Lee, BW; Nam, HS; Kwon, D | ARTICLE | 512 |
| 2005-03 | Influence of tip bluntness on the size-dependent nanoindentation hardness | Kim, Ju-Young; Lee, BW; Read, DT; Kwon, D | ARTICLE | 558 |
| 2007-03 | Loading rate effect on inelastic deformation in a Zr-based bulk metallic glass | Lee, Y. -H.; Kim, Ju-Young; Nahm, S. H.; Kwon, D | ARTICLE | 529 |
| 2006-06 | Mechanical characterization of nano-structured materials using nanoindentation | Kim, Ju-Young; Kim, SH; Lee, JS; Lee, KW; Kwon, D | ARTICLE | 493 |
| 2004 | Molecular dynamics analysis of structure and intrinsic stress in amorphous silicon carbide film with deposition process parameters | Kim, Ju-Young; Lee, BW; Nam, HS; Kwon, D | ARTICLE | 528 |
| 2006-03 | Optimum definition of true strain beneath a spherical indenter for deriving indentation flow curves | Jeon, EC; Kim, Ju-Young; Baik, MK; Kim, SH; Park, JS; Kwon, D | ARTICLE | 589 |
| 2003-12 | Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry | Lee, BW; Kim, Ju-Young; Kwon, D | ARTICLE | 531 |
| 2005-10 | Tensile properties and fatigue crack growth in LIGA nickel MEMS structures | Son, D; Kim, JJ; Kim, Ju-Young; Kwon, D | ARTICLE | 632 |
