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Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis File

Lee, BW , Jeong, JH , Jang, W , Kim, Ju-Young , Kim, DW , Kwon, D , Nah, JW , Paik, KW

Article Issue Date2003-04 View183
Effect of substrate temperature on structure and intrinsic stress in vapor-deposited amorphous silicon carbide film File

Kim, Ju-Young , Lee, BW , Nam, HS , Kwon, D

Article Issue Date2004-11 View128
Influence of tip bluntness on the size-dependent nanoindentation hardness File

Kim, Ju-Young , Lee, BW , Read, DT , Kwon, D

Article Issue Date2005-03 View116
Loading rate effect on inelastic deformation in a Zr-based bulk metallic glass File

Lee, Y. -H. , Kim, Ju-Young , Nahm, S. H. , Kwon, D

Article Issue Date2007-03 View105
Mechanical characterization of nano-structured materials using nanoindentation

Kim, Ju-Young , Kim, SH , Lee, JS , Lee, KW , Kwon, D

Article Issue Date2006-06 View128
Molecular dynamics analysis of structure and intrinsic stress in amorphous silicon carbide film with deposition process parameters File

Kim, Ju-Young , Lee, BW , Nam, HS , Kwon, D

Article Issue Date2004 View126
Optimum definition of true strain beneath a spherical indenter for deriving indentation flow curves File

Jeon, EC , Kim, Ju-Young , Baik, MK , Kim, SH , Park, JS , Kwon, D

Article Issue Date2006-03 View164
Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry File

Lee, BW , Kim, Ju-Young , Kwon, D

Article Issue Date2003-12 View111
Tensile properties and fatigue crack growth in LIGA nickel MEMS structures File

Son, D , Kim, JJ , Kim, Ju-Young , Kwon, D

Article Issue Date2005-10 View114
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