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Showing results 1 to 9 of 9

Issue DateTitleAuthor(s)TypeView
2003-04Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysisLee, BW; Jeong, JH; Jang, W; Kim, Ju-Young; Kim, DW; Kwon, D; Nah, JW; Paik, KWARTICLE912
2004-11Effect of substrate temperature on structure and intrinsic stress in vapor-deposited amorphous silicon carbide filmKim, Ju-Young; Lee, BW; Nam, HS; Kwon, DARTICLE780
2005-03Influence of tip bluntness on the size-dependent nanoindentation hardnessKim, Ju-Young; Lee, BW; Read, DT; Kwon, DARTICLE814
2007-03Loading rate effect on inelastic deformation in a Zr-based bulk metallic glassLee, Y. -H.; Kim, Ju-Young; Nahm, S. H.; Kwon, DARTICLE783
2006-06Mechanical characterization of nano-structured materials using nanoindentationKim, Ju-Young; Kim, SH; Lee, JS; Lee, KW; Kwon, DARTICLE812
2004Molecular dynamics analysis of structure and intrinsic stress in amorphous silicon carbide film with deposition process parametersKim, Ju-Young; Lee, BW; Nam, HS; Kwon, DARTICLE764
2006-03Optimum definition of true strain beneath a spherical indenter for deriving indentation flow curvesJeon, EC; Kim, Ju-Young; Baik, MK; Kim, SH; Park, JS; Kwon, DARTICLE920
2003-12Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometryLee, BW; Kim, Ju-Young; Kwon, DARTICLE813
2005-10Tensile properties and fatigue crack growth in LIGA nickel MEMS structuresSon, D; Kim, JJ; Kim, Ju-Young; Kwon, DARTICLE926
Showing results 1 to 9 of 9