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High-frequency testing of vertical interconnection array using indirect contact probing method with an improved calibration File

Jeong, Jongwoo , Kim, Jingook , Kang, No-Weon , Han, Ki Jin

Article Issue Date2016-11 View68
Indirect Contact Probing Method for Characterizing Vertical Interconnections in Electronic Packaging File

Jeong, Jongwoo , Kim, Jingook , Kang, No-Weon , Han, Ki Jin

Article Issue Date2015-01 View65
Indirect contact probing method for characterizing vertical interconnects File File

Jeong, Jongwoo

Thesis Issue Date2015-08 View29
Modeling of Through-Silicon Via (TSV) Interposer Considering Depletion Capacitance and Substrate Layer Thickness Effects File

Han, Ki Jin , Swaminathan, Madhavan , Jeong, Jongwoo

Article Issue Date2015-01 View59
Multi-Port Characterization of Vias Using Indirect Contact Probing Method File

Jeong, Jongwoo , Kim, Jingook , Kang, No-Weon , Han, Ki Jin

Conference Paper Issue Date2015-05-26 View28
간접 접촉 프로빙 기법을 이용한 수직 인터컨넥트 배열의 전기적 특성추출

Han, Ki Jin , Kim, Jingook , Kang, Nowon , Jeong, Jongwoo

Conference Paper Issue Date2014-08-21 View19
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