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Showing results 1 to 20 of 77

Issue DateTitleAuthor(s)TypeView
2014-05-113-D FDFD non-conformal domain decomposition method for modeling RDL traces on silicon interposerXie, Biancun; Swaminathan, Madhavan; Han, Ki Jin; Xie, JianyongCONFERENCE48
20133D Path finder methodology for the design of 3DICs and interposersSwaminathan, Madhavan; Martin, Bill; Han, Ki JinCONFERENCE50
2014-08-06A common-Mode Active Filter in a Compact Package for a Switching Mode Power SupplyKim, Jingook; Shin, Dongil; Kim, Sungnam; Jeong, Geunseok; Park, Jaesu; Park, Joungwook; Han, Ki JinCONFERENCE53
2016-08-21A modified square Koch curve fractal stent antenna design for medical implantsPatel, Ramesh; Bien, Franklin; Han, Ki JinCONFERENCE48
2014-05A path finding based SI design methodology for 3D integrationHan, Ki Jin; Martin, Bill; Swaminathan, MadhavanCONFERENCE76
2014-10A performance analysis for interconnections of 3D ICs with frequency-dependent TSV model in S-parameterHan, Ki Jin; Lim, Younghyun; Kim, YoungminARTICLE718
2017-08-30A preliminary analysis of domain coupling in package power distribution networkBae, Byoungjin; Kim, Seungwon; Kim, Youngmin; Kang, Seokhyeong; Kim, Il Joon; Kim, Kwangseok; Kang, Sunwon; Han, Ki JinCONFERENCE64
2015-08Analysis and Design Guide of Active EMI Filter in a Compact Package for Reduction of Common-Mode Conducted EmissionsShin, Dongil; Kim, Sungnam; Park, Jaesu; Park, Joungwook; Jeong, Geunseok; Han, Ki Jin; Kim, JingookARTICLE1013
2014-11-05Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV modelsKim, Seungwon; Han, Ki Jin; Kang, Seokhyeong; Kim, YoungminCONFERENCE51
2014-02Analysis of power integrity of multi-layer 3D IC with PEEC-based PDNHan, Ki Jin; Kim, Seungwon; Kim, YoungminCONFERENCE45
2016-11-15Combined Integral Equation Based Circuit Modeling of Interconnections in Electronic PackagingHan, Ki Jin; Swaminathan, MadhavanCONFERENCE63
2015-04Common Mode Noise Reduction for an LLC Resonant Converter by Using Passive Noise CancellationRyu, Younggon; Kim, Sungnam; Jeong, Geunseok; Park, Jaesu; Kim, Duil; Park, Jongwook; Kim, Jingook; Han, Ki JinARTICLE816
2014-06Comparison Study on Harmonic Loss of MW-Class Wind Generators With HTS Field WindingSeo, Jang Ho; Han, Ki Jin; Choi, Hong Soon; Lee, Se-Hee; Hahn, Seungyong; Lee, HaigunARTICLE765
2012-12-09Consideration of MOS Capacitance Effect in TSV Modeling Based on Cylindrical Modal Basis FunctionsHan, Ki Jin; Swaminathan, MadhavanCONFERENCE53
2011-08-14Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsHan, Ki Jin; Xie, Biancun; Swaminathan, Madhavan; Xie, JianyongCONFERENCE63
2016-03Design Considerations of Resonant Network and Transformer Magnetics for High Frequency LLC Resonant ConverterPark, Hwa-Pyeong; Ryu, Young-Gon; Han, Ki Jin; Jung, Jee-HoonARTICLE717
2018-02Design optimization for the insulation of HVDC converter transformers under composite electric stressesYea. Manje; Han, Ki Jin; Park, Jaeyoung; Lee, Seungwook; Choi, JongungARTICLE435
2016-02Design Optimization of Insulation Structure for HVDC converter transformer using Genetic Algorithm with Reliability AnalysisHan, Ki Jin; Yea, ManjeMaster's thesis837
2015-10-21Design Optimization of Parallel Oil-Barrier Insulation Structure of HVDC Converter Transformer Using Genetic AlgorithmYea, Manje; Park, Jaeyong; Lee, Seungwook; Han, Ki JinCONFERENCE43
2015-06Design Study on a 100-kA/20-K HTS Cable for Fusion MagnetsHahn, Seungyong; Song, Jungbin; Kim, Youngjae; Han, Ki Jin; Lee, Haigun; Iwasa. Yukikazu; Chu, YongARTICLE727
Showing results 1 to 20 of 77