2014-05-11 | 3-D FDFD non-conformal domain decomposition method for modeling RDL traces on silicon interposer | Xie, Biancun; Swaminathan, Madhavan; Han, Ki Jin; Xie, Jianyong | CONFERENCE | 296 |
2013 | 3D Path finder methodology for the design of 3DICs and interposers | Swaminathan, Madhavan; Martin, Bill; Han, Ki Jin | CONFERENCE | 324 |
2014-08-06 | A common-Mode Active Filter in a Compact Package for a Switching Mode Power Supply | Kim, Jingook; Shin, Dongil; Kim, Sungnam; Jeong, Geunseok; Park, Jaesu; Park, Joungwook; Han, Ki Jin | CONFERENCE | 273 |
2016-08-21 | A modified square Koch curve fractal stent antenna design for medical implants | Patel, Ramesh; Bien, Franklin; Han, Ki Jin | CONFERENCE | 229 |
2014-05 | A path finding based SI design methodology for 3D integration | Han, Ki Jin; Martin, Bill; Swaminathan, Madhavan | CONFERENCE | 272 |
2014-10 | A performance analysis for interconnections of 3D ICs with frequency-dependent TSV model in S-parameter | Han, Ki Jin; Lim, Younghyun; Kim, Youngmin | ARTICLE | 1065 |
2017-08-30 | A preliminary analysis of domain coupling in package power distribution network | Bae, Byoungjin; Kim, Seungwon; Kim, Youngmin; Kang, Seokhyeong; Kim, Il Joon; Kim, Kwangseok; Kang, Sunwon; Han, Ki Jin | CONFERENCE | 281 |
2015-08 | Analysis and Design Guide of Active EMI Filter in a Compact Package for Reduction of Common-Mode Conducted Emissions | Shin, Dongil; Kim, Sungnam; Park, Jaesu; Park, Joungwook; Jeong, Geunseok; Han, Ki Jin; Kim, Jingook | ARTICLE | 1373 |
2014-11-05 | Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV models | Kim, Seungwon; Han, Ki Jin; Kang, Seokhyeong; Kim, Youngmin | CONFERENCE | 282 |
2014-02 | Analysis of power integrity of multi-layer 3D IC with PEEC-based PDN | Han, Ki Jin; Kim, Seungwon; Kim, Youngmin | CONFERENCE | 235 |
2016-11-15 | Combined Integral Equation Based Circuit Modeling of Interconnections in Electronic Packaging | Han, Ki Jin; Swaminathan, Madhavan | CONFERENCE | 247 |
2015-04 | Common Mode Noise Reduction for an LLC Resonant Converter by Using Passive Noise Cancellation | Ryu, Younggon; Kim, Sungnam; Jeong, Geunseok; Park, Jaesu; Kim, Duil; Park, Jongwook; Kim, Jingook; Han, Ki Jin | ARTICLE | 1224 |
2014-06 | Comparison Study on Harmonic Loss of MW-Class Wind Generators With HTS Field Winding | Seo, Jang Ho; Han, Ki Jin; Choi, Hong Soon; Lee, Se-Hee; Hahn, Seungyong; Lee, Haigun | ARTICLE | 1044 |
2012-12-09 | Consideration of MOS Capacitance Effect in TSV Modeling Based on Cylindrical Modal Basis Functions | Han, Ki Jin; Swaminathan, Madhavan | CONFERENCE | 331 |
2011-08-14 | Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems | Han, Ki Jin; Xie, Biancun; Swaminathan, Madhavan; Xie, Jianyong | CONFERENCE | 237 |
2016-03 | Design Considerations of Resonant Network and Transformer Magnetics for High Frequency LLC Resonant Converter | Park, Hwa-Pyeong; Ryu, Young-Gon; Han, Ki Jin; Jung, Jee-Hoon | ARTICLE | 1000 |
2018-02 | Design optimization for the insulation of HVDC converter transformers under composite electric stresses | Yea. Manje; Han, Ki Jin; Park, Jaeyoung; Lee, Seungwook; Choi, Jongung | ARTICLE | 744 |
2016-02 | Design Optimization of Insulation Structure for HVDC converter transformer using Genetic Algorithm with Reliability Analysis | Han, Ki Jin; Yea, Manje | Master's thesis | 1227 |
2015-10-21 | Design Optimization of Parallel Oil-Barrier Insulation Structure of HVDC Converter Transformer Using Genetic Algorithm | Yea, Manje; Park, Jaeyong; Lee, Seungwook; Han, Ki Jin | CONFERENCE | 287 |
2015-06 | Design Study on a 100-kA/20-K HTS Cable for Fusion Magnets | Hahn, Seungyong; Song, Jungbin; Kim, Youngjae; Han, Ki Jin; Lee, Haigun; Iwasa. Yukikazu; Chu, Yong | ARTICLE | 1099 |