Scholarworks@UNIST

Early Degradation Detection of the Insulation Resistance of MLCCs by the Pattern Analysis of Capacitance and Dissipation Signals

Conference Paper Issue Date2009-05-26 View6

Development of a Non-Invasive On-Chip Interconnect Health Sensing Method Based on Bit Error Rates File File

Shin, Insun , Koo, Kyoungmin , Kwon, Daeil

Article Issue Date2018-10 View19

Development of Accelerated Life Test for Modules of Semiconductor Equipment

박주영 , 신인선 , 권대일

Conference Paper Issue Date2016-04-28 View7

Baek, Soojeong , Kwon, Daeil , Kim, Duck Young

Conference Paper Issue Date2017-10-18 View11

Early Degradation Detection of the Insulation Resistance of Multi-Layer Ceramic Capacitors by the Pattern Analysis of Capacitance and Dissipation Signals File

Baek, Sujeong , Kwon, Daeil , Kim, Duck Young

Article Issue Date2018-09 View14

Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance File

Effect of Uncertain Material Properties on Fan-Out Wafer Level Packaging using Finite Element Analysis

Article Issue Date2009-06 View13

Early detection of interconnect degradation using RF impedance and SPRT File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-10-06 View17

Early identification of emerging technologies: A machine learning approach using multiple patent indicators File

Lee, Changyong , Kwon, Ohjin , Kim, Myeongjung , Kwon, Daeil

Article Issue Date2018-02 View13

Effect of humidity changes on dimensional stability of 3D printed parts by selective laser sintering File

Kwon, Daeil , Park, Eunju , Ha, Sangho , Kim, Namhun

Article Issue Date2017-09 View8

Effect of Solder Joint Degradation on RF Impedance File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-05-12 View12

Kim, Geumtaek , Kwon, Daeil

Conference Paper Issue Date2018-10-26 View10

Failure Prediction of MLCCs using Symbolic Time Series Analysis

Park, Juyoung , Kwon, Daeil

Conference Paper Issue Date2015-11-11 View8

Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Humidity-Bias Testing Conditions Using Non-Linear Modeling File File

Hygroscopic swelling behavior of Nylon 12 parts produced via selective laser sintering process

Article Issue Date2013-09 View15

FEA Modeling and Solder Fatigue Model for New Physical Damage Based UC to TC Requirement Approach File

Kwon, Daeil , Han, Ru , Pei, Min , Lucero, Alan , Ge, Yun , Harries, Richard , Zheng, Tieyu

Conference Paper Issue Date2013-05-28 View4

Hygroscopic Swelling Behavior of 3D Printed Parts due to Changes in Environmental Conditions File

Park, Ju-young , Ha, Sangho , Park, Eunju , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2016-08-21 View9

HYGROSCOPIC SWELLING BEHAVIOR OF 3D PRINTED PARTS DUE TO CHANGES IN ENVIRONMENTAL CONDITIONS File

Park, Juyoung , Ha, Sangho , Park, Eunjoo , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2016-08-23 View9

Ha, Sangho , Park, Eunjoo , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2016-10-10 View8

Identification of Interconnect Failure Mechanisms Using RF Impedance Analysis File

Kwon, Daeil , None

Conference Paper Issue Date2009-51-02 View13

Improved Reliability Prediction Methodology for Electronic Packages Using RF Impedance Analysis

Knowledge Based Risk Assessment for Electronic Products and Systems Based on Probabilistic Use Condition

Conference Paper Issue Date2013 View3

Industry 4.0: A Special Section in IEEE Access File File

Su, Shun-Feng , Rudas, Imre J. , Zurada, Jacek M. , Er, Meng Joo , Chou, Jyh-Horng , Kwon, Daeil

Article Issue Date2017-07 View9

Interconnect Failure Detection using Digital Signal Characteristics of Electronics

이진우 , 권대일

Conference Paper Issue Date2016-04-07 View6

IoT-Based Prognostics and Systems Health Management for Industrial Applications File File

Kwon, Daeil , Hodkiewicz, Melinda , Fan, Jiajie , Shibutani, Tadahiro , Pecht, Michael G.

Article Issue Date2016-07 View10

Conference Paper Issue Date2014-04-03 View8

Life Test Planning for Improved Reliability Prediction under Limited Time-to-Failure Data

Lifetime Prediction of Optocouplers in Digital Input and Output Modules based on Bayesian tracking approaches

Conference Paper Issue Date2015-10-23 View9

Conference Paper Issue Date2017-07-12 View8

Lifetime Prediction of Optocouplers in Digital Input and Output Modules based on Bayesian Tracking Approaches File

Managerial and Industrial Information Prognosis: from Business Decision Making to Asset Management

Article Issue Date2018-08 View5

Kwon, Daeil , Shin, Jiseon

Conference Paper Issue Date2018-08-06 View4

Non-Destructive Wire Fault Diagnosis Using Resistance Spectroscopy Analysis

Park, Eunjoo , Kwon, Daeil

Conference Paper Issue Date2018-08-21 View11

Nondestructive Sensing of Interconnect Failure Mechanisms Using Time-Domain Reflectometry File

Article Issue Date2011-05 View13

Optimal Interval Censoring Design for Reliability Prediction of Electronic Packages File File

Kwon, Daeil , Shin, Insun

Article Issue Date2015-06 View8

Optimized Reliability Test Design to Reduce Uncertainties in Reliability Assessment File

Kwon, Daeil , None

Conference Paper Issue Date2012-05-29 View6

Optimized Stress Allocation Strategies for Qualification of Electronic Products

Conference Paper Issue Date2013-10-06 View6

PHM(Prognostics and Health Management)-based Decision Making with Case Studies

Shin, Jiseon , Lee, Jinwoo , Kwon, Daeil

Conference Paper Issue Date2017-11-18 View5

PHM-based wiring system damage estimation for near zero downtime in manufacturing facilities File

Lee, Jinwoo , Kwon, Daeil , Kim, Namhun , Lee, Changyong

Article Issue Date2019-04 View9

Prognostics and Health Management for Near-Zero Downtime in Smart Manufacturing

Conference Paper Issue Date2017-12-15 View6

Prognostics Based Early Detection of Electronic Package Failures

Conference Paper Issue Date2013-12-19 View4

Prognostics of Electronics based on Big-data Analytics and Physics-of-Failure Modeling

Prognostics of interconnect degradation using RF impedance monitoring and sequential probability ratio test

Conference Paper Issue Date2014-05-22 View4

Kwon, Daeil , Azarian, M.H. , Pecht, M.

Article Issue Date2010-09 View9

Prognostics of Solder Joint Reliability Based on Impedance Analysis and Particle Filtering

Conference Paper Issue Date2015-04-16 View3

Real-time Diagnosis of Wire Degradation based on Digital Signal Analysis File

Lee, Jinwoo , Kwon, Daeil

Conference Paper Issue Date2017-05-31 View9

Real-time Health Monitoring of Wiring Systems for Smart Manufacturing

Lee, Jinwoo , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2018-11-05 View13

Reduction of Li-ion Battery Qualification Time Based on Prognostics and Health Management

이진우 , 권대일

Conference Paper Issue Date2017-10-19 View12

Reduction of Li-ion Battery Qualification Time Based on Prognostics and Health Management File

Kwon, Daeil , Lee, Jinwoo , Pecht, Michael

Article Issue Date2019-09 View11

Reliability Assessment of Low-Power Processor Packages in Supercomputing Systems

Conference Paper Issue Date2016-10-25 View8

Reliability Assessment of Low-Power Processors in Supercomputing Systems File

Article Issue Date2017-08 View16

Reliability Prediction of Optocouplers based on Bayesian tracking approaches

신인선 , 권대일

Conference Paper Issue Date2017-04-07 View3

Remaining-Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process Regression File

Kwon, Daeil , Azarian, Michael H , Pecht, Michael

Article Issue Date2015-11 View6

Service Life Estimation of Supercomputing Systems based on Low-power Processors

Shin, Insun , Park, Juyoung , Kwon, Daeil

Conference Paper Issue Date2016-06-23 View8

Solder Joint Damage as Function of User Behavior