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Heterogeneous 3D CFET with Hybrid Channel Configuration

Author(s)
Kim, SanghyeonKim, SeongkwangLim, HyeongRakJeong, JaeyongPark, YoungkeunJeong, JaejoongKim, JoonpyoKim, BonghoGeum, DaemyeongKim, YounghyunCho, Byung Jin
Issued Date
2025-03-09
DOI
10.1109/EDTM61175.2025.11041288
URI
https://scholarworks.unist.ac.kr/handle/201301/91120
Fulltext
https://ieeexplore.ieee.org/abstract/document/11041288
Citation
IEEE Electron Devices Technology and Manufacturing Conference
Abstract
Complementary field-effect transistors (CFETs) have been seriously studied for next-generation device architectures to improve PPA (power, performance, and area). However, many challenges remain, including process integration, structure optimization, implementation schemes (monolithic/sequential), etc. At the transistor level, unbalanced transport between n- and p-FET would be one of the most critical issues because CFETs inherently require the same width both for n- and p-FETs. Furthermore, new parameters such as spacing length between top and bottom FETs have emerged. Here, we discuss the opportunity for heterogeneous channel design to mitigate these issues.
Publisher
IEEE

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