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- Kim, Jiyun
- Material Intelligence Lab.
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Optofluidic packaging of silicon microchips for applications in light emitting devices
- Author(s)
- Chung, SE, Lee, SA, Kim, Jiyun, Kwon, S
- Issued Date
- 2009-06
- Citation
- The 15th International Conference on Solid-State Sensors, Actuators and Microsystems
- Abstract
- We demonstrate optofluidic packaging of silicon microchips using image processing-based optofluidic maskless lithography (IP-OFML). Optofluidic maskless lithography (OFML) is a dynamic photopolymerization technique for free-floating microstructures within a fluidic channel using a MEMS spatial light modulator. OFML via computer vision-aided image processing enables individual polymer packaging of each microdevice for protection. Furthermore, our technology is applicable to phosphor coating of light emitting diodes (LEDs).
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