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- Kim, Jiyun
- Material Intelligence Lab.
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | US | - |
| dc.citation.title | The 15th International Conference on Solid-State Sensors, Actuators and Microsystems | - |
| dc.contributor.author | Chung, SE | - |
| dc.contributor.author | Lee, SA | - |
| dc.contributor.author | Kim, Jiyun | - |
| dc.contributor.author | Kwon, S | - |
| dc.date.accessioned | 2023-12-20T04:08:17Z | - |
| dc.date.available | 2023-12-20T04:08:17Z | - |
| dc.date.created | 2016-08-24 | - |
| dc.date.issued | 2009-06 | - |
| dc.description.abstract | We demonstrate optofluidic packaging of silicon microchips using image processing-based optofluidic maskless lithography (IP-OFML). Optofluidic maskless lithography (OFML) is a dynamic photopolymerization technique for free-floating microstructures within a fluidic channel using a MEMS spatial light modulator. OFML via computer vision-aided image processing enables individual polymer packaging of each microdevice for protection. Furthermore, our technology is applicable to phosphor coating of light emitting diodes (LEDs). | - |
| dc.identifier.bibliographicCitation | The 15th International Conference on Solid-State Sensors, Actuators and Microsystems | - |
| dc.identifier.doi | 10.1109/SENSOR.2009.5285518 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/41269 | - |
| dc.identifier.url | http://ieeexplore.ieee.org/document/5285518/?reload=true&arnumber=5285518 | - |
| dc.language | 영어 | - |
| dc.publisher | TRANSDUCERS | - |
| dc.title | Optofluidic packaging of silicon microchips for applications in light emitting devices | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2009-06-21 | - |
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