| 2012-05-30 | 32 nm FinFET-based 0.7-to-1.1 V digital voltage sensor with 50 mV resolution | Kim, Youngmin; Nguyen, HV | CONFERENCE | 69 |
| 2013-05 | A high resolution and high linearity 45 nm CMOS fully digital voltage sensor for low power applications | Ryu, Myunghwan; Kim, Youngmin | ARTICLE | 796 |
| 2016-10-26 | A novel design methodology for error-resilient circuits in near-Threshold computing | Lee, Jaemin; Kim, Sunmean; Kim, Youngmin; Kang, Seokhyeong | CONFERENCE | 164 |
| 2012-02 | A novel methodology for speeding up IC performance in 32nm FinFET | Nguyen, Hung Viet; Ryu, Myunghwan; Kim, Youngmin | ARTICLE | 734 |
| 2014-10 | A performance analysis for interconnections of 3D ICs with frequency-dependent TSV model in S-parameter | Han, Ki Jin; Lim, Younghyun; Kim, Youngmin | ARTICLE | 770 |
| 2017-08-30 | A preliminary analysis of domain coupling in package power distribution network | Bae, Byoungjin; Kim, Seungwon; Kim, Youngmin; Kang, Seokhyeong; Kim, Il Joon; Kim, Kwangseok; Kang, Sunwon; Han, Ki Jin | CONFERENCE | 95 |
| 2012 | A Simple and Accurate Modeling of Non-rectilinear Gate Shape with Trapezoidal Approximation | Kim, Youngmin | CONFERENCE | 60 |
| 2018-04 | A Theoretically Sound Approach to Analog Circuit Sizing | Lim, Eunji; Choi, Jaehyouk; Kim, Youngmin | ARTICLE | 383 |
| 2015-09 | A Wide Range On-Chip Leakage Sensor Using a Current-Frequency Converting Technique in 65-nm Technology Node | Choi, Jaehyouk; Kang, Yesung; Kim, Youngmin | ARTICLE | 991 |
| 2015-10-05 | An optimal operating point by using error monitoring circuits with an error-resilient technique | Lee, Jaemin; Kim, Seungwon; Kim, Youngmin; Kang, Seokhyeong | CONFERENCE | 94 |
| 2017-09 | Analysis and reduction of the voltage noise of multi-layer 3D IC with multi-paired power delivery network | Kim, Seungwon; Kim, Youngmin | ARTICLE | 377 |
| 2014-11-05 | Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV models | Kim, Seungwon; Han, Ki Jin; Kang, Seokhyeong; Kim, Youngmin | CONFERENCE | 78 |
| 2020-10-04 | Analysis of Deterioration of Lithium-Ion Cells Through Parameter Measurement | Kim, Youngmin; Jeong, Kyeong-Min | CONFERENCE | 63 |
| 2014-11-05 | Analysis of On Chip Decoupling Capacitor in the Double-gate FinFETs with PEEC-based Power Delivery Networks | Lee, Jaemin; Kang, Yesung; Kim, Youngmin | CONFERENCE | 79 |
| 2014-02 | Analysis of power integrity of multi-layer 3D IC with PEEC-based PDN | Han, Ki Jin; Kim, Seungwon; Kim, Youngmin | CONFERENCE | 75 |
| 2014-11-05 | Analysis of Structural Variation and Threshold Voltage Modulation in 10-nm Double Gate-All-Around (DGAA) Transistor | Ryu, Myunghwan; Kim, Youngmin | CONFERENCE | 71 |
| 2014-12 | Comprehensive Performance Analysis of Interconnect Variation by double and triple patterning lithography processes | Kim, Youngmin; Lee, Jaemin; Ryu, Myunghwan | ARTICLE | 690 |
| 2015-02 | Cryptography Engine Design for IEEE 1609.2 WAVE Secure Vehicle Communication using FPGA | Kim, Youngmin; Jeong, Chanbok | Master's thesis | 1909 |
| 2011-11 | Diffusion-rounded CMOS for improving both I-on and I-off characteristics | Ryu, Myunghwan; Nguyen, Hung Viet; Kim, Youngmin | ARTICLE | 761 |
| 2011 | Effects of Contact Size and Schottky Barrier Height on Nanoscale Contact | Kim, Youngmin | CONFERENCE | 55 |
