or enter first few letters:
  • Sort by:
  • In order:
  • Results/Page
  • Authors/Record:

Showing results 1 to 20 of 58

Issue DateTitleAuthor(s)TypeView
2012-05-3032 nm FinFET-based 0.7-to-1.1 V digital voltage sensor with 50 mV resolutionKim, Youngmin; Nguyen, HVCONFERENCE118
2013-05A high resolution and high linearity 45 nm CMOS fully digital voltage sensor for low power applicationsRyu, Myunghwan; Kim, YoungminARTICLE868
2016-10-26A novel design methodology for error-resilient circuits in near-Threshold computingLee, Jaemin; Kim, Sunmean; Kim, Youngmin; Kang, SeokhyeongCONFERENCE204
2012-02A novel methodology for speeding up IC performance in 32nm FinFETNguyen, Hung Viet; Ryu, Myunghwan; Kim, YoungminARTICLE803
2014-10A performance analysis for interconnections of 3D ICs with frequency-dependent TSV model in S-parameterHan, Ki Jin; Lim, Younghyun; Kim, YoungminARTICLE862
2017-08-30A preliminary analysis of domain coupling in package power distribution networkBae, Byoungjin; Kim, Seungwon; Kim, Youngmin; Kang, Seokhyeong; Kim, Il Joon; Kim, Kwangseok; Kang, Sunwon; Han, Ki JinCONFERENCE147
2012A Simple and Accurate Modeling of Non-rectilinear Gate Shape with Trapezoidal ApproximationKim, YoungminCONFERENCE94
2018-04A Theoretically Sound Approach to Analog Circuit SizingLim, Eunji; Choi, Jaehyouk; Kim, YoungminARTICLE446
2015-09A Wide Range On-Chip Leakage Sensor Using a Current-Frequency Converting Technique in 65-nm Technology NodeChoi, Jaehyouk; Kang, Yesung; Kim, YoungminARTICLE1086
2015-10-05An optimal operating point by using error monitoring circuits with an error-resilient techniqueLee, Jaemin; Kim, Seungwon; Kim, Youngmin; Kang, SeokhyeongCONFERENCE140
2017-09Analysis and reduction of the voltage noise of multi-layer 3D IC with multi-paired power delivery networkKim, Seungwon; Kim, YoungminARTICLE439
2014-11-05Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV modelsKim, Seungwon; Han, Ki Jin; Kang, Seokhyeong; Kim, YoungminCONFERENCE124
2020-10-04Analysis of Deterioration of Lithium-Ion Cells Through Parameter MeasurementKim, Youngmin; Jeong, Kyeong-MinCONFERENCE119
2014-11-05Analysis of On Chip Decoupling Capacitor in the Double-gate FinFETs with PEEC-based Power Delivery NetworksLee, Jaemin; Kang, Yesung; Kim, YoungminCONFERENCE114
2014-02Analysis of power integrity of multi-layer 3D IC with PEEC-based PDNHan, Ki Jin; Kim, Seungwon; Kim, YoungminCONFERENCE119
2014-11-05Analysis of Structural Variation and Threshold Voltage Modulation in 10-nm Double Gate-All-Around (DGAA) TransistorRyu, Myunghwan; Kim, YoungminCONFERENCE112
2014-12Comprehensive Performance Analysis of Interconnect Variation by double and triple patterning lithography processesKim, Youngmin; Lee, Jaemin; Ryu, MyunghwanARTICLE751
2015-02Cryptography Engine Design for IEEE 1609.2 WAVE Secure Vehicle Communication using FPGAKim, Youngmin; Jeong, ChanbokMaster's thesis2043
2011-11Diffusion-rounded CMOS for improving both I-on and I-off characteristicsRyu, Myunghwan; Nguyen, Hung Viet; Kim, YoungminARTICLE819
2011Effects of Contact Size and Schottky Barrier Height on Nanoscale ContactKim, YoungminCONFERENCE92
Showing results 1 to 20 of 58