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A 3-DIMENSIONAL HIGH-THROUGHPUT ARCHITECTURE USING THROUGH-WAFER OPTICAL INTERCONNECT File

WILLS, D. Scott , Lacy, W. Stephen , Camperi-Ginestet, Christophe , Buchanan, Brent , Cat, Huy H. , Wilkinson, Scott , Lee, Myunghee , Jokerst, Nan Marie , Brooke, Martin A.

Article Issue Date1995-06 View79
A three-layer 3-D silicon system using through-Si vertical optical interconnections and SiCMOS hybrid building blocks File

Bond, Steve W. , Vendier, Olivier , Lee, Myunghee , Jung, Sungyong , Vrazel, Michael , Lopez-Lagunas, Abelardo , Chai, Sek , Dagnall, Georgianna , Brooke, Martin , Jokerst, Nan Marie , et al

Article Issue Date1999-03 View90
Silicon VLSI processing architectures incorporating integrated optoelectronic devices File

Lee, Myunghee , Cat, Huy H. , Buchanan, Brent , Wills, D. Scott , Brooke, Martin , Jokerst, Nan Marie

Conference Paper Issue Date1995-03-27 View63
Thin-film multimaterial optoelectronic integrated circuits File

Jokerst, Nan Marie , Brooke, Martin A. , Vendier, Olivier , Wilkinson, Scott , Fike, Suzanne , Lee, Myunghee , Twyford, Elizabeth , Cross, Jeffrey , Buchanan, Brent , Wills, Scott

Article Issue Date1996-02 View90
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