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Lee, Myunghee
Automotive Electronic Systems and Semiconductor Lab
Research Interests
  • Automotive Electronic System Design
  • Automtoive Semicondutor IC design

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Thin-film multimaterial optoelectronic integrated circuits

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Title
Thin-film multimaterial optoelectronic integrated circuits
Author
Jokerst, Nan MarieBrooke, Martin A.Vendier, OlivierWilkinson, ScottFike, SuzanneLee, MyungheeTwyford, ElizabethCross, JeffreyBuchanan, BrentWills, Scott
Keywords
Epitaxial liftoff; Interconnect network; Optoelectronics; Thin film devices
Issue Date
1996-02
Publisher
Institute of Electrical and Electronics Engineers
Citation
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY. PART B, ADVANCED PACKAGING, v.19, no.1, pp.97 - 106
Abstract
The multimaterial integration of thin-film optoelectronic devices with host substrates ranging from silicon circuits to glass waveguides to polymer micromachines offers to the system designer the freedom to choose the optimal materials for each component to achieve performance and cost objectives. Thin-film compound semiconductor optoelectronic devices are comparable to, and, in some cases, better than, their on-wafer counterparts. Thin-film detectors have been integrated with receiver circuits and movable micromachines, thin-film emitters with drive circuitry, and both have been used to demonstrate three-dimensionally interconnected systems. Vertical electrical integration of detector arrays on top of circuits is examined for massively parallel processing of images. Vertical optical interconnections of stacked silicon circuits (which are transparent to the wavelength of light used) are explored, and are used to develop a massively parallel processing architecture based upon low memory, high throughput, and high input/output
URI
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DOI
10.1109/96.486491
ISSN
1070-9894
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EE_Journal Papers
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