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A biodegradable and self-deployable electronic tent electrode for brain cortex interfacing File

Bae, Jae-Young , Hwang, Gyeong-Seok , Kim, Young-Seo , Jeon, Jooik , Chae, Minseong , Kim, Joon-Woo , Lee, Sian , Kim, Seongchan , Lee, Soo-Hwan , Choi, Sung-Geun , et al

Article Issue Date2024-08 View8

Bio-implantation strategy for the bio-interfaces with minimally invasive surgery based on the mechanical analysis

Hwang, Gyeong-Seok , Bae, Jae-Young , Kang, Seung-Kyun , Kim, Ju-Young

Conference Paper Issue Date2023-11-28 View26

Biodegradable Metallic Glass for Stretchable Transient Electronics File File

Bae, Jae-Young , Gwak, Eun-Ji , Hwang, Gyeong-Seok , Hwang, Hae Won , Lee, Dong-Ju , Lee, Jong-Sung , Joo, Young-Chang , Sun, Jeong-Yun , Jun, Sang Ho , Ok, Myoung-Ryul , et al

Article Issue Date2021-05 View17

Correlation between formability of dual and complex phase steels and hardness of constituent phases

Song, Eun-Ji , Hwang, Gyeong-Seok , Kim, Ju-Young

Conference Paper Issue Date2019-06-26 View21

Development of Highly Stretchable and Impermeable Encapsulation by Applying Wavy-structure to Thermally Grown Silicon Dioxide

Kim, Hangeul , Hwang, Gyeong-Seok , Yoo, Hyeonji , Lee, Sohyeon , Kim, Ju-Young

Conference Paper Issue Date2022-10-10 View21

Enhanced biaxial stretchability of wrinkled SiO2 thin films for stretchable encapsulation File

Kim, Na-Hyang , Hwang, Gyeong-Seok , Kim, Hangeul , Kim, Si-Hoon , Woo, Jeong-Hyun , Song, Myoung Hoon , Kim, Ju-Young

Article Issue Date2022-01 View24

Enhanced Flaw-tolerance of Nanoporous Gold with Grain Boundary Plasticity

Song, Eunji , Kim, Younghoon , Hwang, Gyeong-Seok , Kim, Ju-Young

Conference Paper Issue Date2022-10-10 View14

Enhanced Flaw-tolerance of Nanoporous Gold with Optimum Grain Structure

Song, Eunji , Kim, Younghoon , Hwang, Gyeong-Seok , Byun, Myunghwan , Kim, Ju-Young

Conference Paper Issue Date2022-11-07 View13

Enhanced Stretchability of Wavy-Structured Thermally Grown Silicon Dioxide Films for Stretchable Encapsulation File

Kim, Hangeul , Hwang, Gyeong-Seok , Lee, Sukbin , Kim, Ju-Young

Article Issue Date2023-07 View20

Flexible Organic/Inorganic Multilayer Encapsulation for Transient Electronics

Yoo, Hyeonji , Hwang, Gyeong-Seok , Kim, Ju-Young

Conference Paper Issue Date2022-11-07 View7

Highly Elastic and Conductive Metallic Interconnect with Crystalline-Amorphous Nanolaminate File

Hwang, Gyeong-Seok , Bae, Jae-Young , Kim, Joon-Woo , Park, Sun-Young , Kim, Jeonghyun , Kang, Seung-Kyun , Kim, Ju-Young

Article Issue Date2023-03 View19

Highly Elastic Metal Nanolaminates with Nanocrystalline Cu and Metallic Glass Alternating Layers for Stretchable Electronics

Hwang, Gyeong-Seok , Lee, Sohyeon , Kim, Ju-Young

Conference Paper Issue Date2022-11-07 View14

Highly elastic, conductive and reliable nanolaminates with nanocrystalline Cu/metallic glass alternating layers

Hwang, Gyeong-Seok , Bae, Jae-Young , Kim, Jun-Woo , Kim, Jeonghyun , Kang, Seungn-Kyun , Kim, Ju-Young

Conference Paper Issue Date2023-11-27 View18

Highly impermeable and flexible silica encapsulation films synthesized by sol-gel process File

Kim, Si-Hoon , Hwang, Gyeong-Seok , Koo, Donghwan , Seo, Dong-Hyun , Kwon, Ye-Pil , Lee, Hansuek , Park, Hyesung , Jeon, Eun-chae , Kim, Ju-Young

Article Issue Date2022-08 View36

Highly stretchable thermally-grown silicon dioxide with wavy structures encapsulation for biomedical applications

Yoo, Hyeonji , Kim, Hanguel , Hwang, Gyeong-Seok , Kim, Ju-Young

Conference Paper Issue Date2023-11-27 View23

Hybrid Bonding of Cu Bumps and Insulating Polymers in Semiconductor Devices

Sim, Youngju , Kim, Hangeul , Hwang, Gyeong-Seok , Kim, Ju-Young

Conference Paper Issue Date2022-11-07 View20

Improvement of Structural Stability and Characterization of Nanoscale Defects in Amorphous Alumina Thin Film

Woo, Jeong-Hyun , Hwang, Gyeong-Seok , Yoo, Hyeonji , Kim, Ju-Young

Conference Paper Issue Date2022-10-10 View17

Lifetime-configurable soft robots via photodegradable silicone elastomer composites File File

Oh, Min-Ha , Kim, Young-Hwan , Lee, Seung-Min , Hwang, Gyeong-Seok , Kim, Kyung-Sub , Kim, Yoon-Nam , Bae, Jae-Young , Kim, Ju-Young , Lee, Ju-Yong , Kim, Yu-Chan , et al

Article Issue Date2023-08 View24

Low-Temperature Cu Bump-Insulating Polymer Hybrid Bonding for Semiconductor 3D IC Packaging Application

Sim, Youngju , Hwang, Gyeong-Seok , Kim, Ju-Young

Conference Paper Issue Date2023-10-26 View18

Material and structural design for multifunctional deformable electronics based on nanomechanics File

Hwang, Gyeong-Seok

Thesis Issue Date2024-02 View12

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