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- Kim, Ju-Young
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Low-Temperature Cu Bump-Insulating Polymer Hybrid Bonding for Semiconductor 3D IC Packaging Application
- Author(s)
- Sim, Youngju, Hwang, Gyeong-Seok, Kim, Ju-Young
- Issued Date
- 2023-10-26
- Citation
- ISMP 2023
- Publisher
- The Korean Microelectronics and Packaging Society (KMEPS)
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