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3-D FDFD non-conformal domain decomposition method for modeling RDL traces on silicon interposer File

Xie, Biancun , Swaminathan, Madhavan , Han, Ki Jin , Xie, Jianyong

Conference Paper Issue Date2014-05-11 View6

3D Path finder methodology for the design of 3DICs and interposers File

Swaminathan, Madhavan , Martin, Bill , Han, Ki Jin

Conference Paper Issue Date2013 View8

3상 교류 전동기 프레임의 전자기 방사 잡음 차폐효과 분석

조혁준 , 한기진

Conference Paper Issue Date2016-07-15 View6

3상 농형 유도 전동기의 베어링 전압 특성 예측 방법 및 장치

예만제 , 한기진

Patent Issue Date View5

3상 전동기의 다중단자망 임피던스 파라미터 추출장치 및 방법

류영곤 , 한기진

Patent Issue Date View9

3상 전동기의 임피던스 파라미터 추출 장치 및 방법

채웅찬 , 문상훈 , 김정식 , 신영진 , 조형준 , 한기진 , 류영곤

Patent Issue Date View7

A common-Mode Active Filter in a Compact Package for a Switching Mode Power Supply File

Kim, Jingook , Shin, Dongil , Kim, Sungnam , Jeong, Geunseok , Park, Jaesu , Park, Joungwook , Han, Ki Jin

Conference Paper Issue Date2014-08-06 View8

A modified square Koch curve fractal stent antenna design for medical implants File

Patel, Ramesh , Bien, Franklin , Han, Ki Jin

Conference Paper Issue Date2016-08-21 View7

A path finding based SI design methodology for 3D integration File

Han, Ki Jin , Martin, Bill , Swaminathan, Madhavan

Conference Paper Issue Date2014-05 View9

A performance analysis for interconnections of 3D ICs with frequency-dependent TSV model in S-parameter File

Han, Ki Jin , Lim, Younghyun , Kim, Youngmin

Article Issue Date2014-10 View6

A preliminary analysis of domain coupling in package power distribution network File

Bae, Byoungjin , Kim, Seungwon , Kim, Youngmin , Kang, Seokhyeong , Kim, Il Joon , Kim, Kwangseok , Kang, Sunwon , Han, Ki Jin

Conference Paper Issue Date2017-08-30 View6

Analysis and Design Guide of Active EMI Filter in a Compact Package for Reduction of Common-Mode Conducted Emissions File

Shin, Dongil , Kim, Sungnam , Park, Jaesu , Park, Joungwook , Jeong, Geunseok , Han, Ki Jin , Kim, Jingook

Article Issue Date2015-08 View3

Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV models File

Kim, Seungwon , Han, Ki Jin , Kang, Seokhyeong , Kim, Youngmin

Conference Paper Issue Date2014-11-05 View7

Analysis of power integrity of multi-layer 3D IC with PEEC-based PDN

Han, Ki Jin , Kim, Seungwon , Kim, Youngmin

Conference Paper Issue Date2014-02 View8

Broad E-plane HPBW using Mode Matching Technique for Automotive Radar Application

Han, Ki Jin

Conference Paper Issue Date2014-12-04 View4

Combined Integral Equation Based Circuit Modeling of Interconnections in Electronic Packaging File

Han, Ki Jin , Swaminathan, Madhavan

Conference Paper Issue Date2016-11-15 View7

Common Mode Noise Reduction for an LLC Resonant Converter by Using Passive Noise Cancellation File

Ryu, Younggon , Kim, Sungnam , Jeong, Geunseok , Park, Jaesu , Kim, Duil , Park, Jongwook , Kim, Jingook , Han, Ki Jin

Article Issue Date2015-04 View6

Comparison Study on Harmonic Loss of MW-Class Wind Generators With HTS Field Winding File

Seo, Jang Ho , Han, Ki Jin , Choi, Hong Soon , Lee, Se-Hee , Hahn, Seungyong , Lee, Haigun

Article Issue Date2014-06 View10

Consideration of MOS Capacitance Effect in TSV Modeling Based on Cylindrical Modal Basis Functions File

Han, Ki Jin , Swaminathan, Madhavan

Conference Paper Issue Date2012-12-09 View9

Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems File

Han, Ki Jin , Xie, Biancun , Swaminathan, Madhavan , Xie, Jianyong

Conference Paper Issue Date2011-08-14 View8

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