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Effect of Scandium Insertion Into the Gate-Stack of Ferroelectric Field-Effect Transistors

Author(s)
Kim, Bong HoKuk, Song-HyeonKim, Seong KwangKim, Joon PyoSuh, Yoon-JeJeong, JaeyongGeum, Dae-MyeongBaek, Seung-HyubKim, Sang Hyeon
Issued Date
2023-04
DOI
10.1109/TED.2023.3244900
URI
https://scholarworks.unist.ac.kr/handle/201301/90868
Fulltext
https://ieeexplore.ieee.org/abstract/document/10050415
Citation
IEEE TRANSACTIONS ON ELECTRON DEVICES, v.70, no.4, pp.1996 - 2000
Abstract
demonstrated improved switching volt-age and retention and endurance characteristics in HfZrOx (HZO)-based ferroelectric field-effect transistors (FeFETs) via oxygen scavenging with Sc. Insertion of Sc into the gate-stack successfully reduced the thickness of the inter-facial SiOx layer (IL) between HZO and Si; thus, the FeFET with Sc could perform an immediate read-after-write at a 2-V pulse. In addition, although the IL thickness became thinner, the endurance characteristics of FeFETs with Sc were improved up to 10(10) cycles, due to the lower Vg required for the same memory window (MW) and less trapping when positive pulses are applied. We believe that this work contributes to the low-voltage operation of FeFET and proposes the potential of oxygen scavenging.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
ISSN
0018-9383
Keyword (Author)
Ferroelectric field-effect transistor (FeFET)hafnium zirconium oxidelow operating voltageoxygen scavengingscandium
Keyword
RELIABILITYLAYER

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