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- Park, Young-Bin
- Functional Intelligent Materials Lab.
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Study on Improving Adhesion in Overmolding Process via Injection-Compression Molding
- Author(s)
- Kim, Donguk, Shim, Yoon-Bo, Park, Young-Bin
- Issued Date
- 2025-12-03
- Citation
- 19th Japan International SAMPE Symposium & Exhibition
- Publisher
- SAMPE
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