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- Park, Young-Bin
- Functional Intelligent Materials Lab.
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | JA | - |
| dc.citation.title | 19th Japan International SAMPE Symposium & Exhibition | - |
| dc.contributor.author | Kim, Donguk | - |
| dc.contributor.author | Shim, Yoon-Bo | - |
| dc.contributor.author | Park, Young-Bin | - |
| dc.date.accessioned | 2026-01-02T09:17:44Z | - |
| dc.date.available | 2026-01-02T09:17:44Z | - |
| dc.date.created | 2025-12-23 | - |
| dc.date.issued | 2025-12-03 | - |
| dc.identifier.bibliographicCitation | 19th Japan International SAMPE Symposium & Exhibition | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/89589 | - |
| dc.publisher | SAMPE | - |
| dc.title | Study on Improving Adhesion in Overmolding Process via Injection-Compression Molding | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2025-12-02 | - |
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