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- Lee, Dong Woog
- Interfacial Physics and Chemistry Lab.
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Temperature-Responsive Adhesives for Sustainable Electronics Disassembly
- Author(s)
- Lee, Geonwoo, Hwang, Jeonguk, Lim, Daegyun, Kim, Young Eun, Park, Jintae, Baek, Myung-Jin, Kim, Hak-Sun, Park, Keum Hwan, Lee, Dong Woog
- Issued Date
- 2024-04-04
- Citation
- 한국고분자학회 2024년 춘계 정기총회 및 학술대회
- Publisher
- 한국고분자학회
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