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- Kim, Ju-Young
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반도체 3차원 패키징 적용을 위한 저온 하이브리드 접합 공정 및 신뢰성 평가
- Author(s)
- 심영주, 황경석, Kim, Ju-Young
- Issued Date
- 2024-04-24
- Citation
- 2024 대한금속재료학회 춘계학술대회
- Publisher
- 대한금속재료학회
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