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- Kim, Ju-Young
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | 2024 대한금속재료학회 춘계학술대회 | - |
| dc.contributor.author | 심영주 | - |
| dc.contributor.author | 황경석 | - |
| dc.contributor.author | Kim, Ju-Young | - |
| dc.date.accessioned | 2024-12-19T11:05:10Z | - |
| dc.date.available | 2024-12-19T11:05:10Z | - |
| dc.date.created | 2024-12-17 | - |
| dc.date.issued | 2024-04-24 | - |
| dc.identifier.bibliographicCitation | 2024 대한금속재료학회 춘계학술대회 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/85000 | - |
| dc.publisher | 대한금속재료학회 | - |
| dc.title | 반도체 3차원 패키징 적용을 위한 저온 하이브리드 접합 공정 및 신뢰성 평가 | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2024-04-24 | - |
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