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- Park, Heechun
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Architecture, Chip, and Package Co-design Flow for 2.5D Integration of Reusable IP Chiplets
- Author(s)
- Kim, Jinwoo, Park, Heechun, Lim, Sung Kyu
- Issued Date
- 2019-06-02
- Citation
- IEEE/ACM Design Automation Conference (DAC), 2019
- Publisher
- IEEE/ACM
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