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Kim, Byungjo
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Atomistic-scale Simulations on Surface Activation Process of Dielectric Oxides for Hybrid Bonding Applications

Author(s)
Hahn, Seung HoLee, HyunjaeJo, Young HyunKim, ByungjoKim, WooyoungChoi, WonyoungLim, KyeongbinRhee, Minwoo
Issued Date
2021-12-01
URI
https://scholarworks.unist.ac.kr/handle/201301/81308
Citation
The 23rd IEEE Electronics Packaging Technology Conference
Publisher
IEEE

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