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- Kim, Byungjo
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | SI | - |
| dc.citation.title | The 23rd IEEE Electronics Packaging Technology Conference | - |
| dc.contributor.author | Hahn, Seung Ho | - |
| dc.contributor.author | Lee, Hyunjae | - |
| dc.contributor.author | Jo, Young Hyun | - |
| dc.contributor.author | Kim, Byungjo | - |
| dc.contributor.author | Kim, Wooyoung | - |
| dc.contributor.author | Choi, Wonyoung | - |
| dc.contributor.author | Lim, Kyeongbin | - |
| dc.contributor.author | Rhee, Minwoo | - |
| dc.date.accessioned | 2024-02-05T15:35:08Z | - |
| dc.date.available | 2024-02-05T15:35:08Z | - |
| dc.date.created | 2024-02-05 | - |
| dc.date.issued | 2021-12-01 | - |
| dc.identifier.bibliographicCitation | The 23rd IEEE Electronics Packaging Technology Conference | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/81308 | - |
| dc.publisher | IEEE | - |
| dc.title | Atomistic-scale Simulations on Surface Activation Process of Dielectric Oxides for Hybrid Bonding Applications | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2021-12-01 | - |
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