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Park, Jang-Ung
Flexible Nano-electronics & Biotechnology Lab
Research Interests
  • Wireless wearable electronics, flexible electronics, printed electronics, nano-bio interfaces

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Stamp collapse in soft lithography

Cited 94 times inthomson ciCited 104 times inthomson ci
Title
Stamp collapse in soft lithography
Author
Huang, YGYZhou, WXHsia, KJMenard, EPark, Jang-UngRogers, JAAlleyne, AG
Keywords
Roof collapse; Soft lithography; Stamp collapse
Issue Date
2005-08
Publisher
AMER CHEMICAL SOC
Citation
LANGMUIR, v.21, no.17, pp.8058 - 8068
Abstract
We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.
URI
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DOI
10.1021/la0502185
ISSN
0743-7463
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MSE_Journal Papers
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