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- Kim, Gun-Ho
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THROUGH SILICON VIA WITH A THIN CARBON CEILING FOR C-MEMS DEVICE PACKAGING
- Author(s)
- Kwak, Jong-Hyun, Kundu, Pijus, Kim, Beomsang, KIm, Shin-Kwan, Kim, Gun-Ho, Shin, Heungjoo
- Issued Date
- 2021-06-22
- Citation
- The 21st International Conference on Solid-State Sensors, Actuators and Microsystems
- Publisher
- Transducer Research Foundation
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