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- Kim, Gun-Ho
- SoftHeat Lab.
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | US | - |
| dc.citation.title | The 21st International Conference on Solid-State Sensors, Actuators and Microsystems | - |
| dc.contributor.author | Kwak, Jong-Hyun | - |
| dc.contributor.author | Kundu, Pijus | - |
| dc.contributor.author | Kim, Beomsang | - |
| dc.contributor.author | KIm, Shin-Kwan | - |
| dc.contributor.author | Kim, Gun-Ho | - |
| dc.contributor.author | Shin, Heungjoo | - |
| dc.date.accessioned | 2024-01-31T21:39:57Z | - |
| dc.date.available | 2024-01-31T21:39:57Z | - |
| dc.date.created | 2021-12-30 | - |
| dc.date.issued | 2021-06-22 | - |
| dc.identifier.bibliographicCitation | The 21st International Conference on Solid-State Sensors, Actuators and Microsystems | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/77265 | - |
| dc.publisher | Transducer Research Foundation | - |
| dc.title | THROUGH SILICON VIA WITH A THIN CARBON CEILING FOR C-MEMS DEVICE PACKAGING | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2021-06-20 | - |
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