Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry
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- Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry
- Lee, BW; Kim, Ju-Young; Kwon, D
- Bulk solder; Electronic speckle pattern interferometry (ESPI); Finite-element modeling (FEM); Flip-chip; Reliability; Stress-strain curve
- Issue Date
- JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1322 - 1329
- Electronic speckle pattern interferometry (ESPI) was applied to noncontact, real-time evaluation of thermal deformation in a flip-chip solder joint. To measure the deformation of such tiny components as the solder balls in the flip-chip, the spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied. Experimental-computational procedures were developed to obtain stress-strain curves for solder balls in the flip-chip based on finite-element modeling (FEM) of in-plane ESPI thermal displacement data. The stress-strain curve obtained for the flip-chip solder was compared with those for bulk solder. The microstructure was also studied to clarify the stress-strain curve results.
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