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Kim, Ju-Young
Robust Multifunctional Materials Lab
Research Interests
  • Flexible / stretchable devices, nano-mechanics, nanoporous metal, materials reliability

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Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry

DC Field Value Language
dc.contributor.author Lee, BW -
dc.contributor.author Kim, Ju-Young -
dc.contributor.author Kwon, D -
dc.date.accessioned 2014-10-24T00:10:54Z -
dc.date.available 2014-10-24T00:10:54Z -
dc.date.created 2014-10-23 -
dc.date.issued 2003-12 -
dc.identifier.citation JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1322 - 1329 -
dc.identifier.issn 0361-5235 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/7686 -
dc.description.abstract Electronic speckle pattern interferometry (ESPI) was applied to noncontact, real-time evaluation of thermal deformation in a flip-chip solder joint. To measure the deformation of such tiny components as the solder balls in the flip-chip, the spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied. Experimental-computational procedures were developed to obtain stress-strain curves for solder balls in the flip-chip based on finite-element modeling (FEM) of in-plane ESPI thermal displacement data. The stress-strain curve obtained for the flip-chip solder was compared with those for bulk solder. The microstructure was also studied to clarify the stress-strain curve results. -
dc.description.statementofresponsibility open -
dc.language ENG -
dc.publisher SPRINGER -
dc.subject Bulk solder -
dc.subject Electronic speckle pattern interferometry (ESPI) -
dc.subject Finite-element modeling (FEM) -
dc.subject Flip-chip -
dc.subject Reliability -
dc.subject Stress-strain curve -
dc.title Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry -
dc.type ARTICLE -
dc.identifier.scopusid 2-s2.0-0347477195 -
dc.identifier.wosid 000186990100030 -
dc.type.rims ART -
dc.description.wostc 2 *
dc.description.scopustc 3 *
dc.date.tcdate 2015-05-06 *
dc.date.scptcdate 2014-10-23 *
dc.identifier.doi 10.1007/s11664-003-0030-5 -
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