dc.citation.endPage |
1329 |
- |
dc.citation.number |
11 |
- |
dc.citation.startPage |
1322 |
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dc.citation.title |
JOURNAL OF ELECTRONIC MATERIALS |
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dc.citation.volume |
32 |
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dc.contributor.author |
Lee, BW |
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dc.contributor.author |
Kim, Ju-Young |
- |
dc.contributor.author |
Kwon, D |
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dc.date.accessioned |
2023-12-22T11:08:13Z |
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dc.date.available |
2023-12-22T11:08:13Z |
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dc.date.created |
2014-10-23 |
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dc.date.issued |
2003-12 |
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dc.description.abstract |
Electronic speckle pattern interferometry (ESPI) was applied to noncontact, real-time evaluation of thermal deformation in a flip-chip solder joint. To measure the deformation of such tiny components as the solder balls in the flip-chip, the spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied. Experimental-computational procedures were developed to obtain stress-strain curves for solder balls in the flip-chip based on finite-element modeling (FEM) of in-plane ESPI thermal displacement data. The stress-strain curve obtained for the flip-chip solder was compared with those for bulk solder. The microstructure was also studied to clarify the stress-strain curve results. |
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dc.identifier.bibliographicCitation |
JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1322 - 1329 |
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dc.identifier.doi |
10.1007/s11664-003-0030-5 |
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dc.identifier.issn |
0361-5235 |
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dc.identifier.scopusid |
2-s2.0-0347477195 |
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dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/7686 |
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dc.identifier.url |
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=0347477195 |
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dc.identifier.wosid |
000186990100030 |
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dc.language |
영어 |
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dc.publisher |
SPRINGER |
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dc.title |
Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry |
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dc.type |
Article |
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dc.description.journalRegisteredClass |
scopus |
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