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The Future of Hardware Technologies for Computing: N3XT 3D MOSAIC, Illusion Scaleup, Co-Design

Author(s)
Radway, R. M.Sethi, K.Chen, W. C.Kwon, JiminLiu, S.Wu, T. F.Beigne, E.Shulaker, M. M.Wong, H. S.P.Mitra, S.
Issued Date
2021-12-11
DOI
10.1109/IEDM19574.2021.9720647
URI
https://scholarworks.unist.ac.kr/handle/201301/76435
Citation
IEEE International Electron Devices Meeting, pp.25.4.1 - 25.4.4
Abstract
The next leap in computing performance requires the next leap in integration. Just as integrated circuits brought together discrete components, this next level of integration must seamlessly fuse disparate parts of a system - e.g., compute, memory, inter-chip connections - synergistically for large energy and execution time benefits. We present this vision, its challenges, and discuss recent advances at the technology, architecture, and system levels.
Publisher
Institute of Electrical and Electronics Engineers Inc.

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