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- Kim, Gun-Ho
- SoftHeat Lab.
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Through Silicon Via Technology for C-MEMS-Based Sensor Packaging
- Author(s)
- Kwak, Jong-Hyun, Kim, Shin-Kwan, Kim, Gun-Ho, Shin, Heungjoo
- Issued Date
- 2022-08-25
- Citation
- 2022년 한국센서학회 추계학술대회
- Publisher
- 한국센서학회
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