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- Kim, Gun-Ho
- SoftHeat Lab.
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | 2022년 한국센서학회 추계학술대회 | - |
| dc.contributor.author | Kwak, Jong-Hyun | - |
| dc.contributor.author | Kim, Shin-Kwan | - |
| dc.contributor.author | Kim, Gun-Ho | - |
| dc.contributor.author | Shin, Heungjoo | - |
| dc.date.accessioned | 2024-01-31T20:06:59Z | - |
| dc.date.available | 2024-01-31T20:06:59Z | - |
| dc.date.created | 2022-10-21 | - |
| dc.date.issued | 2022-08-25 | - |
| dc.identifier.bibliographicCitation | 2022년 한국센서학회 추계학술대회 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/75553 | - |
| dc.publisher | 한국센서학회 | - |
| dc.title | Through Silicon Via Technology for C-MEMS-Based Sensor Packaging | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2022-08-24 | - |
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