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김학선

Kim, Hak Sun
Internet of Things System Lab.
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Temperature-Responsive Adhesives Based on N-isopropyl acrylamide

Author(s)
Lee, GeonwooHwang, JeongukLim, DaegyunKim, Young EunPark, JintaeBaek, Myung-JinKim, Hak SunPark, Keum HwanKu, Kang HeeLee, Dong Woog
Issued Date
2023-11-09
URI
https://scholarworks.unist.ac.kr/handle/201301/74461
Citation
2023 한국공업화학회 추계 총회 및 학술대회
Publisher
한국공업화학회

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