dc.citation.conferencePlace |
US |
- |
dc.citation.conferencePlace |
Las Vegas, NV |
- |
dc.citation.title |
IEEE Electronic Components and Technology Conference |
- |
dc.contributor.author |
Kwon, Daeil |
- |
dc.contributor.author |
Han, Ru |
- |
dc.contributor.author |
Pei, Min |
- |
dc.contributor.author |
Lucero, Alan |
- |
dc.contributor.author |
Ge, Yun |
- |
dc.contributor.author |
Harries, Richard |
- |
dc.contributor.author |
Zheng, Tieyu |
- |
dc.date.accessioned |
2023-12-20T01:06:29Z |
- |
dc.date.available |
2023-12-20T01:06:29Z |
- |
dc.date.created |
2013-10-11 |
- |
dc.date.issued |
2013-05-28 |
- |
dc.identifier.bibliographicCitation |
IEEE Electronic Components and Technology Conference |
- |
dc.identifier.doi |
10.1109/ECTC.2013.6575669 |
- |
dc.identifier.isbn |
978-147990233-0 |
- |
dc.identifier.issn |
0569-5503 |
- |
dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/66730 |
- |
dc.language |
영어 |
- |
dc.publisher |
IEEE |
- |
dc.title |
FEA Modeling and Solder Fatigue Model for New Physical Damage Based UC to TC Requirement Approach |
- |
dc.type |
Conference Paper |
- |
dc.date.conferenceDate |
2013-05-28 |
- |