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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | US | - |
| dc.citation.conferencePlace | Las Vegas, NV | - |
| dc.citation.title | IEEE Electronic Components and Technology Conference | - |
| dc.contributor.author | Kwon, Daeil | - |
| dc.contributor.author | Han, Ru | - |
| dc.contributor.author | Pei, Min | - |
| dc.contributor.author | Lucero, Alan | - |
| dc.contributor.author | Ge, Yun | - |
| dc.contributor.author | Harries, Richard | - |
| dc.contributor.author | Zheng, Tieyu | - |
| dc.date.accessioned | 2023-12-20T01:06:29Z | - |
| dc.date.available | 2023-12-20T01:06:29Z | - |
| dc.date.created | 2013-10-11 | - |
| dc.date.issued | 2013-05-28 | - |
| dc.identifier.bibliographicCitation | IEEE Electronic Components and Technology Conference | - |
| dc.identifier.doi | 10.1109/ECTC.2013.6575669 | - |
| dc.identifier.isbn | 978-147990233-0 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/66730 | - |
| dc.language | 영어 | - |
| dc.publisher | IEEE | - |
| dc.title | FEA Modeling and Solder Fatigue Model for New Physical Damage Based UC to TC Requirement Approach | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2013-05-28 | - |
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