dc.citation.conferencePlace |
US |
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dc.citation.conferencePlace |
Las Vegas, NV |
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dc.citation.endPage |
165 |
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dc.citation.startPage |
159 |
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dc.citation.title |
IEEE Electronic Components and Technology Conference |
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dc.contributor.author |
Kwon, Daeil |
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dc.contributor.author |
Pei, Min |
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dc.contributor.author |
Han, Ru |
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dc.contributor.author |
Lucero, Alan |
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dc.contributor.author |
Vasudevan, Vasu |
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dc.contributor.author |
Kwasnick, Robert |
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dc.contributor.author |
Polasam, Praveen S |
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dc.date.accessioned |
2023-12-20T01:06:29Z |
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dc.date.available |
2023-12-20T01:06:29Z |
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dc.date.created |
2013-10-11 |
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dc.date.issued |
2013-05-28 |
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dc.description.abstract |
In this paper, a user behavior based solder joint reliability modeling approach has been proposed to estimate the design and test requirements for the second level interconnect (SLI) reliability prediction. This approach uses a numerical tool to integrate solder joint creep damage during the actual use condition that was collected from a large user sample size. The resultant damage per time period was then input to the solder joint fatigue model to estimate equivalent damage to testing duration. The is a physics based approach and is expected to provide more accurate product life prediction and reliability performance demand for BGA package designs. © 2013 IEEE. |
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dc.identifier.bibliographicCitation |
IEEE Electronic Components and Technology Conference, pp.159 - 165 |
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dc.identifier.doi |
10.1109/ECTC.2013.6575567 |
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dc.identifier.isbn |
978-147990233-0 |
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dc.identifier.issn |
0569-5503 |
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dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/66729 |
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dc.identifier.url |
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6575567 |
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dc.language |
영어 |
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dc.publisher |
IEEE |
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dc.title |
Define Electrical Packaging Temperature Cycling Requirement with Field Measured User Behavior Data |
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dc.type |
Conference Paper |
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dc.date.conferenceDate |
2013-05-28 |
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