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Efficient Computation of Capacitive Coupling Between Planar and Cylindrical Interconnections

Author(s)
Han, Ki JinSwaminathan, M
Issued Date
2014-12-15
DOI
10.1109/EDAPS.2014.7030803
URI
https://scholarworks.unist.ac.kr/handle/201301/46673
Fulltext
https://ieeexplore.ieee.org/document/7030803
Citation
IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2014), pp.13 - 16
Abstract
For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%.
Publisher
IEEE

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